JPWO2024029385A5 - - Google Patents
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- Publication number
- JPWO2024029385A5 JPWO2024029385A5 JP2024538942A JP2024538942A JPWO2024029385A5 JP WO2024029385 A5 JPWO2024029385 A5 JP WO2024029385A5 JP 2024538942 A JP2024538942 A JP 2024538942A JP 2024538942 A JP2024538942 A JP 2024538942A JP WO2024029385 A5 JPWO2024029385 A5 JP WO2024029385A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- conductive member
- metal layer
- semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 28
- 239000002184 metal Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 14
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022125359 | 2022-08-05 | ||
| PCT/JP2023/027007 WO2024029385A1 (ja) | 2022-08-05 | 2023-07-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024029385A1 JPWO2024029385A1 (https=) | 2024-02-08 |
| JPWO2024029385A5 true JPWO2024029385A5 (https=) | 2025-04-16 |
Family
ID=89848936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024538942A Pending JPWO2024029385A1 (https=) | 2022-08-05 | 2023-07-24 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250174527A1 (https=) |
| JP (1) | JPWO2024029385A1 (https=) |
| CN (1) | CN119631175A (https=) |
| DE (1) | DE112023003350T5 (https=) |
| WO (1) | WO2024029385A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4468115B2 (ja) * | 2004-08-30 | 2010-05-26 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP2015142072A (ja) * | 2014-01-30 | 2015-08-03 | 株式会社東芝 | 半導体装置 |
| JP2017050489A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 半導体パッケージおよび半導体パッケージの製造方法 |
| JP6995674B2 (ja) * | 2018-03-23 | 2022-01-14 | 株式会社東芝 | 半導体装置 |
| JP2021027116A (ja) * | 2019-08-02 | 2021-02-22 | ローム株式会社 | 半導体装置 |
| JP7473376B2 (ja) * | 2020-03-26 | 2024-04-23 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-07-24 DE DE112023003350.1T patent/DE112023003350T5/de active Pending
- 2023-07-24 CN CN202380055933.8A patent/CN119631175A/zh active Pending
- 2023-07-24 JP JP2024538942A patent/JPWO2024029385A1/ja active Pending
- 2023-07-24 WO PCT/JP2023/027007 patent/WO2024029385A1/ja not_active Ceased
-
2025
- 2025-01-29 US US19/040,553 patent/US20250174527A1/en active Pending
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