JPWO2024018790A5 - - Google Patents
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- Publication number
- JPWO2024018790A5 JPWO2024018790A5 JP2024534968A JP2024534968A JPWO2024018790A5 JP WO2024018790 A5 JPWO2024018790 A5 JP WO2024018790A5 JP 2024534968 A JP2024534968 A JP 2024534968A JP 2024534968 A JP2024534968 A JP 2024534968A JP WO2024018790 A5 JPWO2024018790 A5 JP WO2024018790A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die pad
- lead
- metal layer
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 26
- 229910052751 metal Inorganic materials 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 14
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 238000007789 sealing Methods 0.000 claims 6
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022115058 | 2022-07-19 | ||
| PCT/JP2023/022270 WO2024018790A1 (ja) | 2022-07-19 | 2023-06-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024018790A1 JPWO2024018790A1 (https=) | 2024-01-25 |
| JPWO2024018790A5 true JPWO2024018790A5 (https=) | 2025-03-27 |
Family
ID=89617491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024534968A Pending JPWO2024018790A1 (https=) | 2022-07-19 | 2023-06-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024018790A1 (https=) |
| WO (1) | WO2024018790A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024176740A1 (ja) * | 2023-02-20 | 2024-08-29 | ローム株式会社 | 半導体装置および車両 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6705394B2 (ja) * | 2017-02-16 | 2020-06-03 | 三菱電機株式会社 | 半導体モジュールおよびインバータ装置 |
| US10593612B2 (en) * | 2018-03-19 | 2020-03-17 | Stmicroelectronics S.R.L. | SMDs integration on QFN by 3D stacked solution |
| JP7266508B2 (ja) * | 2019-10-21 | 2023-04-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| DE112021002615T5 (de) * | 2020-08-05 | 2023-03-23 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2023
- 2023-06-15 WO PCT/JP2023/022270 patent/WO2024018790A1/ja not_active Ceased
- 2023-06-15 JP JP2024534968A patent/JPWO2024018790A1/ja active Pending