JPWO2024166846A5 - - Google Patents
Info
- Publication number
- JPWO2024166846A5 JPWO2024166846A5 JP2024576317A JP2024576317A JPWO2024166846A5 JP WO2024166846 A5 JPWO2024166846 A5 JP WO2024166846A5 JP 2024576317 A JP2024576317 A JP 2024576317A JP 2024576317 A JP2024576317 A JP 2024576317A JP WO2024166846 A5 JPWO2024166846 A5 JP WO2024166846A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- resin
- semiconductor device
- back surface
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023017617 | 2023-02-08 | ||
| PCT/JP2024/003633 WO2024166846A1 (ja) | 2023-02-08 | 2024-02-05 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024166846A1 JPWO2024166846A1 (https=) | 2024-08-15 |
| JPWO2024166846A5 true JPWO2024166846A5 (https=) | 2026-01-06 |
Family
ID=92262582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024576317A Pending JPWO2024166846A1 (https=) | 2023-02-08 | 2024-02-05 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250357283A1 (https=) |
| JP (1) | JPWO2024166846A1 (https=) |
| WO (1) | WO2024166846A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233961A (ja) * | 1988-07-23 | 1990-02-05 | Nec Corp | リードフレーム |
| JP2513062B2 (ja) * | 1990-04-17 | 1996-07-03 | 三菱電機株式会社 | リ―ドフレ―ムおよび半導体装置の製造方法 |
| US8093707B2 (en) * | 2009-10-19 | 2012-01-10 | National Semiconductor Corporation | Leadframe packages having enhanced ground-bond reliability |
-
2024
- 2024-02-05 WO PCT/JP2024/003633 patent/WO2024166846A1/ja not_active Ceased
- 2024-02-05 JP JP2024576317A patent/JPWO2024166846A1/ja active Pending
-
2025
- 2025-08-01 US US19/288,125 patent/US20250357283A1/en active Pending