JPWO2023112677A5 - - Google Patents
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- Publication number
- JPWO2023112677A5 JPWO2023112677A5 JP2023567670A JP2023567670A JPWO2023112677A5 JP WO2023112677 A5 JPWO2023112677 A5 JP WO2023112677A5 JP 2023567670 A JP2023567670 A JP 2023567670A JP 2023567670 A JP2023567670 A JP 2023567670A JP WO2023112677 A5 JPWO2023112677 A5 JP WO2023112677A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- thickness direction
- resin
- facing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 31
- 229920005989 resin Polymers 0.000 claims 31
- 238000007789 sealing Methods 0.000 claims 19
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021201802 | 2021-12-13 | ||
| PCT/JP2022/044165 WO2023112677A1 (ja) | 2021-12-13 | 2022-11-30 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023112677A1 JPWO2023112677A1 (https=) | 2023-06-22 |
| JPWO2023112677A5 true JPWO2023112677A5 (https=) | 2024-08-26 |
Family
ID=86774201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567670A Pending JPWO2023112677A1 (https=) | 2021-12-13 | 2022-11-30 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240312878A1 (https=) |
| JP (1) | JPWO2023112677A1 (https=) |
| CN (1) | CN118541798A (https=) |
| DE (1) | DE112022005438T5 (https=) |
| WO (1) | WO2023112677A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025047268A1 (ja) * | 2023-08-25 | 2025-03-06 | ローム株式会社 | 半導体装置 |
| CN118380338A (zh) * | 2024-04-26 | 2024-07-23 | 强茂电子(无锡)有限公司 | 一种无引脚半导体封装器件的制作方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10366948B2 (en) * | 2016-03-17 | 2019-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2018085487A (ja) * | 2016-11-25 | 2018-05-31 | マクセルホールディングス株式会社 | 半導体装置の製造方法および半導体装置 |
| JP6909629B2 (ja) | 2017-05-10 | 2021-07-28 | ローム株式会社 | 半導体装置 |
| JP2021027211A (ja) * | 2019-08-07 | 2021-02-22 | ローム株式会社 | 電子装置 |
| JP2021158317A (ja) * | 2020-03-30 | 2021-10-07 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-30 WO PCT/JP2022/044165 patent/WO2023112677A1/ja not_active Ceased
- 2022-11-30 DE DE112022005438.7T patent/DE112022005438T5/de active Pending
- 2022-11-30 CN CN202280081370.5A patent/CN118541798A/zh active Pending
- 2022-11-30 JP JP2023567670A patent/JPWO2023112677A1/ja active Pending
-
2024
- 2024-05-29 US US18/677,332 patent/US20240312878A1/en active Pending
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