JPWO2023238681A5 - - Google Patents

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Publication number
JPWO2023238681A5
JPWO2023238681A5 JP2024526359A JP2024526359A JPWO2023238681A5 JP WO2023238681 A5 JPWO2023238681 A5 JP WO2023238681A5 JP 2024526359 A JP2024526359 A JP 2024526359A JP 2024526359 A JP2024526359 A JP 2024526359A JP WO2023238681 A5 JPWO2023238681 A5 JP WO2023238681A5
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JP
Japan
Prior art keywords
capacitor
layer
built
electrode layer
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024526359A
Other languages
English (en)
Japanese (ja)
Other versions
JP7597277B2 (ja
JPWO2023238681A1 (https=
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Publication date
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Priority claimed from PCT/JP2023/019506 external-priority patent/WO2023238681A1/ja
Publication of JPWO2023238681A1 publication Critical patent/JPWO2023238681A1/ja
Publication of JPWO2023238681A5 publication Critical patent/JPWO2023238681A5/ja
Application granted granted Critical
Publication of JP7597277B2 publication Critical patent/JP7597277B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024526359A 2022-06-06 2023-05-25 コンデンサアレイ Active JP7597277B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022091679 2022-06-06
JP2022091679 2022-06-06
PCT/JP2023/019506 WO2023238681A1 (ja) 2022-06-06 2023-05-25 コンデンサアレイ

Publications (3)

Publication Number Publication Date
JPWO2023238681A1 JPWO2023238681A1 (https=) 2023-12-14
JPWO2023238681A5 true JPWO2023238681A5 (https=) 2024-11-28
JP7597277B2 JP7597277B2 (ja) 2024-12-10

Family

ID=89118125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024526359A Active JP7597277B2 (ja) 2022-06-06 2023-05-25 コンデンサアレイ

Country Status (5)

Country Link
US (1) US20250087427A1 (https=)
JP (1) JP7597277B2 (https=)
CN (1) CN119301716A (https=)
TW (1) TWI841362B (https=)
WO (1) WO2023238681A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250140483A1 (en) * 2023-10-30 2025-05-01 Saras Micro Devices, Inc. Integrated passive devices with enhanced form factor
US12142429B1 (en) * 2024-03-26 2024-11-12 The Florida International University Board Of Trustees Systems and methods for patterning valve metals
TWI912156B (zh) * 2024-04-01 2026-01-11 日商村田製作所股份有限公司 電容器內設基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5374814B2 (ja) * 2006-09-20 2013-12-25 富士通株式会社 キャパシタ内蔵型配線基板およびその製造方法
US7948739B2 (en) * 2007-08-27 2011-05-24 Nanotek Instruments, Inc. Graphite-carbon composite electrode for supercapacitors
WO2017026233A1 (ja) * 2015-08-10 2017-02-16 株式会社村田製作所 コンデンサ
WO2019221046A1 (ja) * 2018-05-16 2019-11-21 株式会社村田製作所 固体電解コンデンサ
JP7151764B2 (ja) * 2018-06-11 2022-10-12 株式会社村田製作所 コンデンサアレイ、複合電子部品、コンデンサアレイの製造方法、及び、複合電子部品の製造方法
JP7180561B2 (ja) * 2019-03-29 2022-11-30 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品

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