JPWO2022264834A5 - - Google Patents
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- Publication number
- JPWO2022264834A5 JPWO2022264834A5 JP2023529779A JP2023529779A JPWO2022264834A5 JP WO2022264834 A5 JPWO2022264834 A5 JP WO2022264834A5 JP 2023529779 A JP2023529779 A JP 2023529779A JP 2023529779 A JP2023529779 A JP 2023529779A JP WO2022264834 A5 JPWO2022264834 A5 JP WO2022264834A5
- Authority
- JP
- Japan
- Prior art keywords
- main
- semiconductor device
- wiring
- conductive
- viewed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021099537 | 2021-06-15 | ||
| PCT/JP2022/022584 WO2022264834A1 (ja) | 2021-06-15 | 2022-06-03 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264834A1 JPWO2022264834A1 (https=) | 2022-12-22 |
| JPWO2022264834A5 true JPWO2022264834A5 (https=) | 2025-06-03 |
Family
ID=84526427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529779A Pending JPWO2022264834A1 (https=) | 2021-06-15 | 2022-06-03 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240047433A1 (https=) |
| JP (1) | JPWO2022264834A1 (https=) |
| CN (1) | CN117480604A (https=) |
| DE (1) | DE112022002551T5 (https=) |
| WO (1) | WO2022264834A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024257549A1 (https=) * | 2023-06-15 | 2024-12-19 | ||
| WO2025263387A1 (ja) * | 2024-06-18 | 2025-12-26 | ローム株式会社 | 半導体装置、および半導体モジュール |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6300633B2 (ja) | 2014-05-20 | 2018-03-28 | 三菱電機株式会社 | パワーモジュール |
| JP7326314B2 (ja) * | 2018-10-02 | 2023-08-15 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6906583B2 (ja) * | 2019-10-29 | 2021-07-21 | 三菱電機株式会社 | 半導体パワーモジュール |
-
2022
- 2022-06-03 WO PCT/JP2022/022584 patent/WO2022264834A1/ja not_active Ceased
- 2022-06-03 CN CN202280041912.6A patent/CN117480604A/zh active Pending
- 2022-06-03 JP JP2023529779A patent/JPWO2022264834A1/ja active Pending
- 2022-06-03 DE DE112022002551.4T patent/DE112022002551T5/de active Pending
-
2023
- 2023-10-20 US US18/491,355 patent/US20240047433A1/en active Pending
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