JPWO2023190334A5 - - Google Patents
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- Publication number
- JPWO2023190334A5 JPWO2023190334A5 JP2024512456A JP2024512456A JPWO2023190334A5 JP WO2023190334 A5 JPWO2023190334 A5 JP WO2023190334A5 JP 2024512456 A JP2024512456 A JP 2024512456A JP 2024512456 A JP2024512456 A JP 2024512456A JP WO2023190334 A5 JPWO2023190334 A5 JP WO2023190334A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thickness
- path
- portions
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022055494 | 2022-03-30 | ||
| JP2022077301 | 2022-05-10 | ||
| PCT/JP2023/012188 WO2023190334A1 (ja) | 2022-03-30 | 2023-03-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190334A1 JPWO2023190334A1 (https=) | 2023-10-05 |
| JPWO2023190334A5 true JPWO2023190334A5 (https=) | 2024-12-16 |
Family
ID=88201729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024512456A Pending JPWO2023190334A1 (https=) | 2022-03-30 | 2023-03-27 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20240429138A1 (https=) |
| JP (1) | JPWO2023190334A1 (https=) |
| WO (1) | WO2023190334A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025169688A1 (ja) * | 2024-02-08 | 2025-08-14 | ローム株式会社 | 半導体装置 |
| WO2025177812A1 (ja) * | 2024-02-20 | 2025-08-28 | ローム株式会社 | 半導体装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2451077A (en) * | 2007-07-17 | 2009-01-21 | Zetex Semiconductors Plc | Semiconductor chip package |
| JP6279860B2 (ja) * | 2013-09-09 | 2018-02-14 | 三菱電機株式会社 | 半導体装置 |
| KR102004785B1 (ko) * | 2014-03-18 | 2019-07-29 | 삼성전기주식회사 | 반도체모듈 패키지 및 그 제조 방법 |
| JP7267716B2 (ja) * | 2018-11-12 | 2023-05-02 | ローム株式会社 | 半導体装置 |
| DE112021002615T5 (de) * | 2020-08-05 | 2023-03-23 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2023
- 2023-03-27 WO PCT/JP2023/012188 patent/WO2023190334A1/ja not_active Ceased
- 2023-03-27 JP JP2024512456A patent/JPWO2023190334A1/ja active Pending
-
2024
- 2024-09-05 US US18/825,485 patent/US20240429138A1/en active Pending
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