JPWO2023140050A5 - - Google Patents
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- Publication number
- JPWO2023140050A5 JPWO2023140050A5 JP2023575160A JP2023575160A JPWO2023140050A5 JP WO2023140050 A5 JPWO2023140050 A5 JP WO2023140050A5 JP 2023575160 A JP2023575160 A JP 2023575160A JP 2023575160 A JP2023575160 A JP 2023575160A JP WO2023140050 A5 JPWO2023140050 A5 JP WO2023140050A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- semiconductor device
- path
- metal
- path portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 26
- 239000002184 metal Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 10
- 239000012212 insulator Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022006874 | 2022-01-20 | ||
| PCT/JP2022/047695 WO2023140050A1 (ja) | 2022-01-20 | 2022-12-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140050A1 JPWO2023140050A1 (https=) | 2023-07-27 |
| JPWO2023140050A5 true JPWO2023140050A5 (https=) | 2024-10-01 |
Family
ID=87348226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575160A Pending JPWO2023140050A1 (https=) | 2022-01-20 | 2022-12-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240321693A1 (https=) |
| JP (1) | JPWO2023140050A1 (https=) |
| CN (1) | CN118613913A (https=) |
| DE (1) | DE112022006171T5 (https=) |
| WO (1) | WO2023140050A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025169688A1 (ja) * | 2024-02-08 | 2025-08-14 | ローム株式会社 | 半導体装置 |
| WO2025177812A1 (ja) * | 2024-02-20 | 2025-08-28 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039135A (ja) * | 2003-07-18 | 2005-02-10 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2011222707A (ja) * | 2010-04-08 | 2011-11-04 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2015069982A (ja) * | 2013-09-26 | 2015-04-13 | 株式会社日立製作所 | パワーモジュール |
| JP2021190505A (ja) * | 2020-05-27 | 2021-12-13 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-12-23 WO PCT/JP2022/047695 patent/WO2023140050A1/ja not_active Ceased
- 2022-12-23 DE DE112022006171.5T patent/DE112022006171T5/de active Pending
- 2022-12-23 CN CN202280089060.8A patent/CN118613913A/zh active Pending
- 2022-12-23 JP JP2023575160A patent/JPWO2023140050A1/ja active Pending
-
2024
- 2024-06-05 US US18/734,627 patent/US20240321693A1/en active Pending
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