CN118613913A - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN118613913A
CN118613913A CN202280089060.8A CN202280089060A CN118613913A CN 118613913 A CN118613913 A CN 118613913A CN 202280089060 A CN202280089060 A CN 202280089060A CN 118613913 A CN118613913 A CN 118613913A
Authority
CN
China
Prior art keywords
conductive
semiconductor device
metal
path
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280089060.8A
Other languages
English (en)
Chinese (zh)
Inventor
安西智洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118613913A publication Critical patent/CN118613913A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280089060.8A 2022-01-20 2022-12-23 半导体装置 Pending CN118613913A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-006874 2022-01-20
JP2022006874 2022-01-20
PCT/JP2022/047695 WO2023140050A1 (ja) 2022-01-20 2022-12-23 半導体装置

Publications (1)

Publication Number Publication Date
CN118613913A true CN118613913A (zh) 2024-09-06

Family

ID=87348226

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280089060.8A Pending CN118613913A (zh) 2022-01-20 2022-12-23 半导体装置

Country Status (5)

Country Link
US (1) US20240321693A1 (https=)
JP (1) JPWO2023140050A1 (https=)
CN (1) CN118613913A (https=)
DE (1) DE112022006171T5 (https=)
WO (1) WO2023140050A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025169688A1 (ja) * 2024-02-08 2025-08-14 ローム株式会社 半導体装置
WO2025177812A1 (ja) * 2024-02-20 2025-08-28 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039135A (ja) * 2003-07-18 2005-02-10 Fuji Electric Holdings Co Ltd 半導体装置
JP2011222707A (ja) * 2010-04-08 2011-11-04 Mitsubishi Electric Corp 電力用半導体装置
JP2015069982A (ja) * 2013-09-26 2015-04-13 株式会社日立製作所 パワーモジュール
JP2021190505A (ja) * 2020-05-27 2021-12-13 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
US20240321693A1 (en) 2024-09-26
DE112022006171T5 (de) 2024-11-14
JPWO2023140050A1 (https=) 2023-07-27
WO2023140050A1 (ja) 2023-07-27

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