CN115206919A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN115206919A
CN115206919A CN202210322268.1A CN202210322268A CN115206919A CN 115206919 A CN115206919 A CN 115206919A CN 202210322268 A CN202210322268 A CN 202210322268A CN 115206919 A CN115206919 A CN 115206919A
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China
Prior art keywords
heat dissipation
terminal
group
semiconductor device
dissipation plate
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Pending
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CN202210322268.1A
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English (en)
Inventor
胜部弘辉
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN115206919A publication Critical patent/CN115206919A/zh
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Abstract

本申请获得一种抑制大型化和电路电感的增加而不使引线接合工序复杂的半导体装置。该半导体装置包括：形成为板状的散热板；与散热板的一个面接合的多个开关元件；第一端子，该第一端子是在与散热板分离的状态下朝远离散热板的方向延伸的端子，并且经由第一导电体连接到多个开关元件中的与散热板一侧相反一侧的面；以及密封构件，该密封构件对多个开关元件、散热板和第一端子进行密封，在散热板的外周部设置有切口，在垂直于散热板的一个面的方向上观察时，第一端子的散热板一侧的部分与因切口而被切除的区域重叠。

Description

半导体装置
技术领域
本申请涉及半导体装置。
背景技术
在如电动汽车或插电式混合动力汽车那样的电动车辆中，设有用于转换高压电池的电力的功率转换装置。在功率转换装置中，使用利用开关动作转换功率的半导体装置。
半导体装置包括与具有散热性能的金属板接合的半导体开关元件。半导体开关元件通过DLB(Direct-Lead-Bonding：直接引线键合)或引线接合等方法与形成用于功率转换的功率电路的主端子以及连接到进行开关控制的控制电路的控制端子相连接。半导体开关元件由树脂或凝胶等密封构件密封，并且包围半导体开关元件形成密封部。公开了一种半导体装置，该半导体装置的对应于同一半导体开关元件的主端子和控制端子从密封部的一个突出面突出，并且沿着突出面排列配置(例如，参照专利文献1)。
被公开的半导体装置中，半导体装置的主电极和主端子经由连接到半导体元件的背面的主电极的散热板电连接。另一方面，控制端子经由接合线连接到半导体元件的控制电极。上述主端子和控制端子从密封部的一个突出面突出，并且沿突出面并排配置。
现有技术文献
专利文献
专利文献1：日本专利特开2015－185834号公报
发明内容
发明所要解决的技术问题
在上述专利文献1中的半导体装置的结构中，在连接半导体元件的控制电极和控制端子的引线接合工艺中，由于接合工具被压在控制端子的上面而使得控制端子的下面侧被夹具所支承。因此，控制端子配置在未与散热板重叠的状态的位置、即从散热板的外周起使控制端子偏移的位置，半导体元件和控制端子被树脂密封。相应地，密封部的外形和控制端子的从密封部露出的端部被扩大控制端子的偏移量。因此，存在着在控制端子突出的方向上半导体装置大型化的问题。另外，随着半导体装置的大型化，半导体装置的电流路径长度增大，因此存在半导体装置的电路电感增大的问题。
另一方面，如果在散热板和控制端子重叠的状态下配置，则能够抑制在控制端子突出的方向上的半导体装置的大型化。然而，除了用于支承控制端子的传统夹具之外，还需要在引线接合工序中使用用于支承散热板和控制端子之间的支承构件，因此存在引线接合工序复杂的问题。
因此，本申请的目的在于获得一种在不使引线接合工序复杂的情况下，抑制大型化和电路电感的增大的半导体装置。
用于解决技术问题的技术手段
本发明的半导体装置包括：形成为板状的散热板；与散热板的一个面接合的多个开关元件；第一端子，该第一端子是在与散热板分离的状态下朝远离散热板的方向延伸的端子，并且经由第一导电体连接到多个开关元件中的与散热板一侧相反一侧的面；以及密封构件，该密封构件对多个开关元件、散热板和第一端子进行密封，在散热板的外周部设置有切口，在垂直于散热板的一个面的方向上观察时，第一端子的散热板一侧的部分与因切口而被切除的区域重叠。
发明效果
根据本发明所公开的半导体装置，包括第一端子，该第一端子是在与形成为板状的散热板分离的状态下朝远离散热板的方向延伸的端子并且经由第一导电体连接到多个开关元件中的与散热板一侧相反一侧的面，在散热板的外周部设置有切口，在垂直于散热板的一个面的方向上观察时，第一端子的散热板一侧的部分与因切口而被切除的区域重叠，因此，能在引线接合工序中不使用新的支承构件的情况下将第一端子配置在不具有切口的散热板的外周的内侧，因而能抑制在第一端子的延伸方向上的半导体装置的大型化，而不会使引线接合工序复杂。此外，由于第一端子被配置在不具有切口的散热板的外周的内侧，因此半导体装置的电流路径长度缩短，因此能抑制半导体装置的电路电感的增大。
附图说明
图1是表示实施方式1所涉及的半导体装置的外观的俯视图。
图2是表示实施方式1所涉及的半导体装置的结构的概要的俯视图。
图3是表示实施方式1所涉及的半导体装置的外观的侧视图。
图4是表示实施方式1所涉及的半导体装置的散热板的概要的俯视图。
图5是表示在图2的A-A截面位置切断的半导体装置的概要的剖视图。
图6是表示实施方式2所涉及的半导体装置的外观的俯视图。
图7是表示实施方式2所涉及的半导体装置的结构的概要的俯视图。
图8是表示实施方式2所涉及的半导体装置的结构的概要的另一个俯视图。
图9是表示实施方式2所涉及的半导体装置的结构的概要的另一个俯视图。
图10是表示实施方式2所涉及的半导体装置的外观的侧视图。
图11是表示在图7的B-B截面位置切断的半导体装置的概要的剖视图。
具体实施方式
以下，基于附图对本申请的实施方式所涉及的半导体装置进行说明。另外，各图中关于相同或相当的构件、部位，标注相同标号来进行说明。
实施方式1.
图1是表示实施方式1所涉及的半导体装置100的外观的俯视图，图2是表示半导体装置100的结构的概要的俯视图，图3是表示半导体装置100的外观的侧视图，图4是表示半导体装置100的散热板5的概要的俯视图，图5是表示在图2的A-A截面位置切断的半导体装置100的概要的剖视图。图2是去除了作为密封构件的模塑树脂1的情况下示出的图，虚线是模塑树脂1的外形。半导体装置100是具有多个开关元件6、通过开关动作来转换功率的装置。
<半导体装置100>
如图1所示，在半导体装置100中，作为主端子的P端子2和N端子3以及控制端子4从模塑树脂1露出到外部地设置。在本实施方式中，P端子2和控制端子4从相同的模塑树脂1的侧面露出到外部，N端子3从P端子2和控制端子4所露出的侧面的相反侧的侧面露出。各个端子露出的侧面不限于此。这些端子是连接到外部设备的端子。在本实施方式中，半导体装置100包括三个控制端子4。三个控制端子4是作为第一端子的栅极端子4b、作为第二端子的感测端子4c、以及感测源端子4a。虽然模塑树脂1设置为长方体形状，但模塑树脂1的形状并不限于此。如图3所示，各个端子从模塑树脂1的侧面的相同高度露出。另外，设置各个端子的高度也可以根据所连接的外部设备的端子配置等设置为不同的高度。
如图2所示，半导体装置100包括形成为板状的散热板5、与作为散热板5的一个面的元件安装面5a接合的多个开关元件6、P端子2、N端子3、控制端子4、以及密封多个开关元件6、散热板5、P端子2、N端子3和控制端子4的模塑树脂1。在本实施方式中，半导体装置100由传递模塑成型而得，但不限于此，可以使用凝胶等密封构件。当使用凝胶密封时，例如，构成为凝胶被注入到容纳开关元件6等的树脂壳体中。
图4所示的散热板5由具有优异热传导性和导电性的铜或铝等金属制成为矩形。散热板5例如是铜制的散热器。散热板5的材质和形状不限于此。散热板5可以由DBC(DirectBonded Copper：直接键合铜)基板等其它基板材料制成，该DBC基板是通过将陶瓷绝缘基板与铜制的基底板接合后得到的，该陶瓷绝缘基板是通过钎焊等接合有金属箔的绝缘材料。散热板5和开关元件6例如通过焊料进行电接合和热接合。散热板5与开关元件6的接合并不限于焊料，只要是具有高热传导且低电阻的特性的材料即可，例如可以是以银为主要成分的糊料材。由于开关元件6中产生的热量经由散热板5向外部扩散，因此开关元件6被有效冷却。作为本申请的主要部分的散热板5的切口5b将在后面叙述。
开关元件6包括四个开关元件6a、6b、6c、6d。在半导体元件6中使用MOSFET(金属氧化膜型场效应晶体管－Metal Oxide Semiconductor Field Effect Transistor)、IGBT(绝缘栅双极型晶体管、Insulated Gate Bipolar Transistor)等功率控制用半导体元件、或者续流二极管等。开关元件6不限于这些，也可以是双极晶体管等其他开关元件。在本实施方式中，构成为使用MOSFET，并使用MOSFET的寄生二极管作为续流二极管，但是，在利用不具有IGBT等寄生二极管的开关元件的情况等下，也可以采用并联地添加续流二极管的结构。开关元件6形成在由碳化硅、硅或氮化镓等材料形成的半导体基板上。
如图2所示，半导体装置100包括在散热板5的元件安装面5a上与切口5b相邻地配置的感测元件8。感测元件8是经由散热板5测量开关元件6周围的温度的元件。由于感测元件8测量开关元件6周围的温度，因此能抑制开关元件6的温度上升。感测元件8例如是热敏电阻。感测元件8经由作为第二导电体的接合构件的接合线7c连接到感测端子4c和感测源端子4a。
＜端子＞
P端子2、N端子3和控制端子4的各个端子由具有导电性的铜或铝等金属制成。P端子2的一侧连接到散热板5的元件安装面5a，另一侧露出到模塑树脂1的外部并在外部连接到其它设备。N端子3的一侧与设置在开关元件6中的散热板5侧的相反侧的面上的电极接合，另一侧在模塑树脂1的外部露出并在外部连接到其它设备。感测源端子4a是从N端子3的主体部分延伸到与N端子3露出到外部的部分相反一侧的N端子3的延伸部分。感测源端子4a具有与N端子3相同的电位。虽然在本实施方式中，感测源端子4a和N端子3一体化，但是也可以构成为分开设置感测源端子4a和N端子3，并且通过接合线等连接双方。此外，如图5所示，P端子2和N端子3的在模塑树脂1的内部连接的部分设为向连接的一侧凹下去，使得在本实施方式的P端子2和N端子3在模塑树脂1外部露出的部分具有相同的高度。
栅极端子4b是在与散热板5分离的状态下朝远离散热板5的方向上延伸的端子，经由作为第一导电体的接合构件的接合线7a和接合线7b连接到多个开关元件6中与散热板5侧相反一侧的面。开关元件6的连接的部分是各个开关元件6具有的栅极电极9。感测端子4c是在与散热板5分离的状态下朝远离散热板5的方向延伸的端子，并且经由接合线7c连接到感测元件8。接合线7a、7b、7c例如是铝制引线，但不限于此，也可以是铜制带等其他导电体。当将接合构件用于第一导电体和第二导电体中的一个或双方时，与DLB相比，可以构成为能减小导电体的截面积，因而能使半导体装置100小型化。
与元件安装面5a接合的P端子2经由散热板5与设置在开关元件6的散热板5侧的面上的电极相连接。如上所述，N端子3与设置在开关元件6的与散热板5侧相反一侧的面上的电极相连接。通过这些连接，开关元件6的漏极电极之间和源极电极之间并联电连接，从而构成一组臂。
＜切口5b＞
如图4所示，在散热板5的外周部设置有切口5b。切口5b是从散热板5的外周朝向内部切除的部分。在本实施方式中，将切口5b设置为矩形状，但切口5b的形状并不限于此，也可以是用曲线包围的部分。当通过冲压加工制作散热板5时，能在冲压加工时同时地形成切口5b。在制作散热板5之后，可以通过切削加工等去除散热板5的一部分从而形成切口5b。
在垂直于散热板5的元件安装面5a的方向上观察时，栅极端子4b的散热板5侧的部分与因切口5b而被切除的区域重叠。当在垂直于散热板5的元件安装面5a的方向上观察时，感测端子4c的散热板5侧的部分与因切口5b而被切除的区域重叠。
通过这样构成，能将栅极端子4b和感测端子4c配置在不具有切口5b的散热板的外周的内侧，因而能抑制在栅极端子4b和感测端子4c延伸的方向上的半导体装置100的大型化。在引线接合工序中，栅极端子4b和感测端子4c可以在切口5b的区域由夹具支承，因此不需要在散热板5与栅极端子4b和感测端子4c之间进行支承。由于不需要在引线接合工序中使用用于在散热板5与栅极端子4b和感测端子4c之间支承的新的支承构件，因此不会使引线接合工序复杂。此外，能容易地将栅极端子4b和感测端子4c配置在与元件安装面5a同一平面上。此外，由于栅极端子4b被配置在不具有切口5b的散热板的外周的内侧，因此半导体装置100的电流路径长度缩短，因此能抑制半导体装置100的电路电感的增大。
此外，散热板5的体积减小了切口5b的量，并且密度小于用于散热板5的构件的模塑树脂1被填充在切口5b的部分中，因此能减轻半导体装置100的重量。此外，通过设置切口5b，能抑制由构件之间的线性膨胀系数差引起的翘曲。此外，由于模塑树脂1和散热板5之间的接触面积增加，因此能提高模塑树脂1和散热板5之间的密接性。
<开关元件6的配置>
多个开关元件6在散热板5的元件安装面5a夹着切口5b的两侧的区域中夹着切口5b排列成一列。在本实施方式中，多个开关元件6沿着矩形的散热板5的长边排列成一列。此外，开关元件6a、6b被配置在散热板5的元件安装面5a中的夹着切口5b的一侧区域中，开关元件6c、6d被配置在另一侧区域中。通过这样构成，开关元件6隔开间隔地被配置在夹着切口5b的一侧区域和另一侧区域中，因而不易受到来自配置在不同区域中的开关元件6的热干扰。由于不容易受到来自配置在不同区域中的开关元件6的热干扰，因此能提高开关元件6的散热性。
栅极端子4b的连接到接合线7a和接合线7b的部分与栅极电极9在平行于散热板5的元件安装面5a的方向上排列成一列。通过这样构成，使多个开关元件6接近地配置，并且能缩短接合线7a和接合线7b的长度。由于能缩短接合线7a和接合线7b的长度，因此能提高半导体装置100的生产率。
在散热板5的元件安装面5a中的夹有切口5b的一侧区域和另一侧区域中的每一个区域中，彼此相邻的两个开关元件6的各自的栅极电极9之间通过接合线7a或接合线7b连接。与切口5b相邻配置的一侧区域中的一个开关元件6b的栅极电极9和栅极端子4b之间通过接合线7a连接。与切口5b相邻配置的另一侧区域中的一个开关元件6c的栅极电极9和栅极端子4b之间通过接合线7b连接。在本实施方式中，示出了以这种方式通过针脚式接合，各个栅极电极9与栅极端子4b并联连接的示例。接合线7a是用于连接配置在一侧区域中的开关元件6a、6b和栅极端子4b的针脚式布线。接合线7b是用于连接在另一侧区域相对配置的开关元件6c、6d和栅极端子4b的针脚式布线。
通过这样构成，能将连接到多个开关元件6的栅极端子4b接近多个开关元件6地配置在切口5b的区域中。由于将栅极端子4b接近多个开关元件6地配置在切口5b的区域中，因此能使半导体装置100小型化。此外，接合线7a、7b沿着开关元件6排列的方向几乎呈直线地延伸，并且具有低回路和短引线配置，因此在树脂密封工序中不易发生由于接合线7a、7b变形而发生的短路故障，能提高半导体装置100的生产率。在本实施方式中，示出了通过针脚式接合使各个栅极电极9与栅极端子4b并联连接的示例，但不限于此，各个栅极电极9和栅极端子4b可以用不同的引线连接。
在垂直于散热板5的元件安装面5a的方向上观察时，配置在一侧区域中的开关元件6a、6b以及配置在另一侧区域中的开关元件6c、6d相对于第一基准线X呈线对称地配置，该第一基准线X与开关元件6排列的方向垂直。通过这样构成，接合线7a、7b具有相同的长度，能够抑制由布线长度引起的控制信号的偏差。
在本实施方式中，在一侧的区域和另一侧的区域中分别配置了2个开关元件6，但是开关元件6的配置数量并不限于此，也可以分别配置1个或3个以上。此外，虽然每个臂并联连接4个开关元件6，但是开关元件6的并联数量不限于4个。另外，虽然多个开关元件6的各个栅极电极9连接到一个栅极端子4b，但是也可以配置多个栅极端子4b，各个栅极端子4b连接到任一个栅极端子9。
<感测元件8的配置>
在本实施方式中，感测元件8配置在与切口5b相邻并且夹在一侧区域和另一侧区域之间的区域中。在散热板5是图4所示的散热板5的情况下，与切口5b相邻并且夹在一侧区域和另一侧区域之间的区域是在图4中被虚线包围的区域。通过这样构成，感测元件8和开关元件6能够彼此靠近地配置，并且接合线7a、7b和7c能够彼此聚集地配置在控制端子4的周围。因此，半导体装置100能够小型化。此外，能够提高半导体装置100的生产率。
如上所述，在实施方式1的半导体装置100中，包括栅极端子4b，该栅极端子4b是在与形成为板状的散热板5分离的状态下朝远离散热板5的方向延伸的端子，并且经由第一导电体连接到多个开关元件6中的与散热板5侧相反一侧的面，在散热板5的外周部设置有切口5b，在与散热板5的元件安装面5a垂直的方向上观察时，栅极端子4b的散热板5侧的部分与因切口5b而被切除的区域重叠，因此，能在引线接合工序中不使用新的支承构件的情况下将栅极端子4b配置在不具有切口5b的散热板5的外周的内侧，因而能抑制在栅极端子4b的延伸方向上的半导体装置100的大型化，而不会使引线接合工序复杂。此外，由于栅极端子4b被配置在不具有切口5b的散热板的外周的内侧，因此半导体装置100的电流路径长度缩短，因此能抑制半导体装置100的电路电感的增大。
在垂直于散热板5的元件安装面5a的方向上观察时，连接到与切口5b相邻地配置的感测元件8的感测端子4c的散热板5一侧的部分与因切口5b而被切除的区域重叠时，能够将感测端子4c配置在不具有切口5b的散热板5的外周的内侧，而无需在引线接合工序中使用新的支承构件，因而能抑制在感测端子4c的延伸方向上的半导体装置100的大型化，而不会使引线接合工序复杂。此外，当多个开关元件6在散热板5的元件安装面5a夹着切口5b的两侧的区域中夹着切口5b排列成一列时，开关元件6隔开间隔地被配置在夹着切口5b的一侧区域和另一侧区域中，因而不易受到来自配置在不同区域中的开关元件6的热干扰。
当多个开关元件6分别在与散热板5侧相反一侧的面上具有栅极电极9，栅极端子4b和栅极电极9经由接合线7a和接合线7b连接，并且栅极端子4b连接到接合线7a和接合线7b的部分和栅极电极9在平行于散热板5的元件安装面5a的方向上排列成一列时，多个开关元件6能靠近地配置，并且接合线7a和接合线7b的长度能够缩短。另外，在散热板5的元件安装面5a夹着切口5b的一侧区域和另一侧区域的每一个中，当彼此相邻的两个开关元件6各自的栅极电极9之间通过接合线7a或接合线7b连接，与切口5b相邻地配置的一侧区域的一个开关元件6b的栅极电极9和另一侧区域的一个开关元件6c的栅极电极9的每一个与栅极端子4b之间通过接合线7a或接合线7b连接时，能将连接到多个开关元件6的栅极端子4b接近多个开关元件6地配置在切口5b的区域。由于将栅极端子4b接近多个开关元件6地配置在切口5b的区域中，因此能使半导体装置100小型化。
实施方式2.
对实施方式2所涉及的半导体装置200进行说明。图6是示出实施方式2的半导体装置200的外观的俯视图，图7是示出去除模塑树脂1的半导体装置200的结构的概要的俯视图，图8是示出从图7中去除负臂N端子11并示出的半导体装置200的结构的概要的俯视图，图9是示出从图8中去除内引脚13并示出的半导体装置200的结构的概要的俯视图，图10是示出半导体装置200的外观的侧视图，图11是示出在图7的B-B截面位置切断的半导体装置200的主要部分的剖视图。图7所示的虚线是模塑树脂1的外形。实施方式2的半导体装置200构成为设置有两组多个开关元件6、散热板5、栅极端子4b、以及感测端子4c。
<半导体装置200>
半导体装置200包括由开关元件6构成的正臂和负臂。正臂和负臂串联连接。正臂和负臂由模塑树脂1一体成形。这是一般被称为2合1模块的方式。尽管在本实施方式中对2合1结构进行说明，但是半导体装置200可以是4合1结构或6合1结构。
如图6所示，在半导体装置200中，作为主端子的正臂P端子10、负臂N端子11、交流端子12和控制端子4从模塑树脂1露出到外部。在本实施方式中，正臂P端子10和负臂N端子11从相同的模塑树脂1的侧面露出到外部，并且交流端子12从与正臂P端子10和负臂N端子11露出的侧面相反一侧的侧面露出。控制端子4设置在各个侧面上。各端子露出的侧面不限于此。这些端子是连接到外部设备的端子。如图10所示，各个端子从模塑树脂1的侧面的相同高度露出。另外，设置各个端子的高度也可以根据所连接的外部设备的端子配置等设置为不同的高度。
如图9所示，半导体装置200包括两组多个开关元件6、散热板5、栅极端子4b和感测端子4c。在图9中，上侧为正臂侧的第一组，下侧为负臂侧的第二组。第一组的散热板5c和第二组的散热板5d相邻地配置在同一平面上。在本实施方式中，第一组的散热板5c和第二组的散热板5d形成为矩形，彼此的长边相对，并且第一组的散热板5c、第二组的散热板5d和多个开关元件6相对于沿着长边的第二基准线Y呈线对称地配置。开关元件6a、6b、6c、6d与第一组的散热板5c接合，开关元件6e、6f、6g、6h与第二组的散热板5d接合。第一组的散热板5c的切口5b设置在与第二组的散热板5d相反一侧的第一组的散热板5c的外周部上。第二组的散热板5d的切口5b设置在与第一组的散热板5c相反一侧的第二组的散热板5d的外周部上。第一组的栅极端子4b和感测端子4c延伸到与第二组的散热板5d相反一侧。第二组的栅极端子4b和感测端子4c延伸到与第一组的散热板5c相反一侧。
在垂直于第一组的散热板5c和第二组的散热板5d的元件安装面5a的方向上观察时，栅极端子4b的各个第一组的散热板5c和第二组的散热板5d一侧的部分与因切口5b而被切除的区域重叠。在垂直于第一组的散热板5c和第二组的散热板5d的元件安装面5a的方向上观察时，感测端子4c的各个第一组的散热板5c和第二组的散热板5d一侧的部分与因切口5b而被切除的区域重叠。
通过这样构成，能在相邻配置在同一平面上的第一组的散热板5c和第二组的散热板5d双方上形成切口5b，因而能抑制半导体装置200在栅极端子4b和感测端子4c的延伸方向上的大型化。此外，由于栅极端子4b被配置在不具有切口5b的散热板的外周的内侧，因此半导体装置200的电流路径长度缩短，因此能抑制半导体装置200的电路电感的增大。
<内引脚13>
如图8所示，半导体装置200包括内引脚13和作为第三端子的感测源端子4a。内引脚13将设置在开关元件6a、6b、6c、6d的与第一组的散热板5c侧相反一侧的面上的电极和第二组的散热板5d的元件安装面5a相连接，该开关元件6a、6b、6c、6d与第一组的散热板5c的元件安装面5a接合。内引脚13具有延伸部13a，该延伸部13a从主体部分延伸到与第二组的散热板5d相反的一侧。感测源端子4a是在与第一组的散热板5c分离的状态下朝远离第一组的散热板5c的方向延伸的端子。第二组的散热板5d的元件安装面5a与开关元件6e、6f、6g、6h的第二组的散热板5d侧的面上所设置的电极接合。在垂直于第一组的散热板5c的元件安装面5a的方向上观察时，感测源端子4a的第一组的散热板5c侧的部分和延伸部13a分别与第一组的散热板5c的切口5b的区域重叠地配置，延伸部13a经由作为第三导电体的接合构件的接合线7d连接到感测源端子4a。当将接合构件用于第三导电体时，与DLB相比，构成为能减小导电体的截面积，因而能使半导体装置100小型化。
通过这样构成，能将感测源端子4a和延伸部13a配置在不具有切口5b的散热板的外周的内侧，因而能抑制半导体装置200在感测源端子4a和延伸部13a延伸的方向上的大型化。在引线接合工序中，感测源端子4a和延伸部13a能在切口5b的区域中被夹具支承，因此不需要在散热板5与感测源端子4a和延伸部13a之间进行支承。由于不需要在引线接合工序中使用在散热板5与感测源端子4a和延伸部13a之间进行支承的新的支承构件，因此不会使引线接合工序复杂。此外，由于感测源端子4a被配置在不具有切口5b的散热板的外周的内侧，因此半导体装置200的电流路径长度缩短，因此能抑制半导体装置200的电路电感的增大。
<半导体装置200的臂结构>
对半导体装置200的正臂和负臂进行说明。如图8所示，开关元件6a、6b、6c、6d通过第一组的散热板5c和内引脚13并联连接，从而构成正臂。如图7所示，开关元件6e、6f、6g、6h通过第二组的散热板5d和负臂N端子11并联连接，从而构成负臂。正臂P端子10的一侧与正臂的第一组的散热板5c的元件安装面5a接合，另一侧露出到模塑树脂1的外部并在外部连接到其他设备。交流端子12的一侧与负臂的第二组的散热板5d的元件安装面5a接合，另一侧露出到模塑树脂1的外部并在外部连接到其他设备。作为负臂的漏极电位的第二组的散热板5d通过连接到内引脚13而连接到正臂的源极电位。内引脚13连接正臂和负臂。内引脚13和负臂N端子11由两层构成。
在半导体装置200的制造工序中，从图6所示的模塑树脂1露出到外部的各端子被相同的引线框架支承。在各个端子被引线框架支承的状态下通过模塑树脂1进行密封之后，各个端子与引线框架断开。该工序是制造半导体装置的一般的制造工序。在密封工序中，引线框架由树脂成型模具的上模和下模夹持。
在本实施方式中，内引脚13和负臂N端子11由两层构成。在两层结构中，为了避免它们与树脂成形模具之间的干涉，内引脚13设置在模塑树脂1的内部。因此，正臂的感测源端子4a需要与开关元件6a、6b、6c、6d的源极电位具有相同电位，但与内引脚13断开。由此，内引脚13和正臂的感测源端子4a分开设置，并且通过接合线7d连接。
如上所述，在实施方式2的半导体装置200中，包括两组多个开关元件6、散热板5、栅极端子4b、以及感测端子4c，第一组的散热板5c和第二组的散热板5b相邻地配置在同一平面上，第一组的散热板5c的切口5b设置在与第二组的散热板5d相反一侧的第一组的散热板5c的外周部，第二组的散热板5d的切口5b设置在与第一组的散热板5c相反一侧的第二组的散热板5d的外周部，第一组的栅极端子4b和感测端子4c延伸到与第二组的散热板5d相反一侧，第二组的栅极端子4b和感测端子4c延伸到与第一组的散热板5c相反一侧，因此，在同一平面上相邻地配置的第一组的散热板5c和第二组的散热板5d的双方可形成有切口5b，因而能够抑制栅极端子4b和感测端子4c的延伸方向上的半导体装置200的大型化。
内引脚13具有从主体部分延伸到第二组的散热板5d相反一侧的延伸部13a，感测源端子4a在与第一组的散热板5c分离的状态下朝向远离第一组的散热板5c的方向延伸，在垂直于第一组的散热板5c的元件安装面5a的方向上观察时，感测源端子4a的第一组的散热板5c侧的部分和延伸部13a分别与第一组的散热板5c的切口5b的区域重叠地配置，延伸部13a经由接合线7d连接到感测源端子4a，因此，能将感测源端子4a和延伸部13a配置在不具有切口5b的散热板的外周的内侧，因此能够抑制感测源端子4a和延伸部13a的延伸方向上的半导体装置200的大型化。
另外，本申请虽然记载了各种示例性的实施方式以及实施例，但是1个或多个实施方式所记载的各种特征、方式及功能并不仅限于适用特定的实施方式，也可以单独适用于实施方式，或者进行各种组合来适用于实施方式。
因此，可以认为未例示的无数变形例也包含在本申请说明书所公开的技术范围内。例如，设为包括对至少一个构成要素进行变形、添加或省略的情况，以及提取至少一个构成要素并与其他实施方式的构成要素进行组合的情况。
标号说明
1 模塑树脂
2 P端子
3 N端子
4 控制端子
4a 感测源端子
4b 栅极端子
4c 感测端子
5 散热板
5a 元件安装面
5b 切口
5c 第一组的散热板
5d 第二组的散热板
6 开关元件
7a 接合线
7b 接合线
7c 接合线
7d 接合线
8 感测元件
9 栅极电极
10 正臂P端子
11 负臂N端子
12 交流端子
13 内引脚
13a 延伸部
100 半导体装置
200 半导体装置
X 第一基准线
Y 第二基准线。

Claims (10)

1.一种半导体装置，其特征在于，包括：
散热板，该散热板形成为板状；
多个开关元件，该多个开关元件与所述散热板的一个面接合；
第一端子，该第一端子是在与所述散热板分离的状态下朝远离所述散热板的方向延伸的端子，并且经由第一导电体连接到多个所述开关元件中的与所述散热板一侧相反一侧的面；以及
密封构件，该密封构件对多个所述开关元件、所述散热板、以及所述第一端子进行密封，
在所述散热板的外周部设置有切口，
在垂直于所述散热板的一个面的方向上观察时，所述第一端子的所述散热板一侧的部分与因所述切口而被切除的区域重叠。
2.如权利要求1所述的半导体装置，其特征在于，包括：
感测元件，该感测元件在所述散热板的一个面与所述切口相邻地配置；以及
第二端子，该第二端子是在与所述散热板分离的状态下朝远离所述散热板的方向延伸的端子，并且经由第二导电体连接到所述感测元件，
在垂直于所述散热板的一个面的方向上观察时，所述第二端子的所述散热板一侧的部分与因所述切口而被切除的区域重叠。
3.如权利要求1或2所述的半导体装置，其特征在于，
多个所述开关元件在所述散热板的一个面的夹着所述切口的两侧的区域中夹着所述切口排列成一列。
4.如权利要求3所述的半导体装置，其特征在于，
多个所述开关元件分别在与所述散热板一侧相反一侧的面上具有栅极电极，
所述第一端子和所述栅极电极经由所述第一导电体连接，
所述第一端子连接到所述第一导电体的部分和所述栅极电极在平行于所述散热板的一个面的方向上排列成一列。
5.如权利要求4所述的半导体装置，其特征在于，
在所述散热板的一个面中的夹有所述切口的一侧区域和另一侧区域的每一个区域中，彼此相邻的两个所述开关元件各自的所述栅极电极之间通过所述第一导电体连接，
与所述切口相邻地配置的所述一侧区域的一个所述开关元件的所述栅极电极和所述另一侧区域的一个所述开关元件的所述栅极电极的每一个、与所述第一端子之间通过所述第一导电体连接。
6.如权利要求1至5中任一项所述的半导体装置，其特征在于，
设置有两组多个所述开关元件、所述散热板和所述第一端子，
第一组的散热板和第二组的散热板相邻配置在同一平面上，
所述第一组的散热板的所述切口设置在与所述第二组的散热板相反一侧的所述第一组的散热板的外周部，
所述第二组的散热板的所述切口设置在与所述第一组的散热板相反一侧的所述第二组的散热板的外周部，
第一组的所述第一端子延伸到与所述第二组的散热板相反一侧，
第二组的所述第一端子延伸到与所述第一组的散热板相反一侧。
7.如权利要求6所述的半导体装置，其特征在于，包括：
内引脚，该内引脚对与所述第一组的散热板的一个面接合的所述开关元件的与所述散热板一侧相反一侧的面上所设置的电极、以及所述第二组的散热板的一个面进行连接；以及
第三端子，该第三端子是在与所述第一组的散热板分离的状态下朝远离所述第一组的散热板的方向延伸的端子，
所述第二组的散热板的一个面与所述开关元件的所述散热板一侧的面上所设置的电极接合，
所述内引脚具有从主体部分延伸到与所述第二组的散热板相反一侧的延伸部，
在垂直于所述第一组的所述散热板的一个面的方向观察时，所述第三端子的所述第一组的散热板一侧的部分和所述延伸部分别与所述第一组的散热板的因所述切口而被切除的区域重叠地配置，所述延伸部经由第三导电体连接到所述第三端子。
8.如权利要求1至7中任一项所述的半导体装置，其特征在于，
所述第一导电体是接合构件。
9.如权利要求2所述的半导体装置，其特征在于，
所述第二导电体是接合构件。
10.如权利要求7所述的半导体装置，其特征在于，
所述第三导电体是接合构件。
CN202210322268.1A 2021-04-12 2022-03-29 半导体装置 Pending CN115206919A (zh)

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