JPWO2023140050A1 - - Google Patents
Info
- Publication number
- JPWO2023140050A1 JPWO2023140050A1 JP2023575160A JP2023575160A JPWO2023140050A1 JP WO2023140050 A1 JPWO2023140050 A1 JP WO2023140050A1 JP 2023575160 A JP2023575160 A JP 2023575160A JP 2023575160 A JP2023575160 A JP 2023575160A JP WO2023140050 A1 JPWO2023140050 A1 JP WO2023140050A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022006874 | 2022-01-20 | ||
| PCT/JP2022/047695 WO2023140050A1 (ja) | 2022-01-20 | 2022-12-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140050A1 true JPWO2023140050A1 (https=) | 2023-07-27 |
| JPWO2023140050A5 JPWO2023140050A5 (https=) | 2024-10-01 |
Family
ID=87348226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575160A Pending JPWO2023140050A1 (https=) | 2022-01-20 | 2022-12-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240321693A1 (https=) |
| JP (1) | JPWO2023140050A1 (https=) |
| CN (1) | CN118613913A (https=) |
| DE (1) | DE112022006171T5 (https=) |
| WO (1) | WO2023140050A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025169688A1 (ja) * | 2024-02-08 | 2025-08-14 | ローム株式会社 | 半導体装置 |
| WO2025177812A1 (ja) * | 2024-02-20 | 2025-08-28 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039135A (ja) * | 2003-07-18 | 2005-02-10 | Fuji Electric Holdings Co Ltd | 半導体装置 |
| JP2011222707A (ja) * | 2010-04-08 | 2011-11-04 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2015069982A (ja) * | 2013-09-26 | 2015-04-13 | 株式会社日立製作所 | パワーモジュール |
| JP2021190505A (ja) * | 2020-05-27 | 2021-12-13 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-12-23 WO PCT/JP2022/047695 patent/WO2023140050A1/ja not_active Ceased
- 2022-12-23 DE DE112022006171.5T patent/DE112022006171T5/de active Pending
- 2022-12-23 CN CN202280089060.8A patent/CN118613913A/zh active Pending
- 2022-12-23 JP JP2023575160A patent/JPWO2023140050A1/ja active Pending
-
2024
- 2024-06-05 US US18/734,627 patent/US20240321693A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240321693A1 (en) | 2024-09-26 |
| CN118613913A (zh) | 2024-09-06 |
| DE112022006171T5 (de) | 2024-11-14 |
| WO2023140050A1 (ja) | 2023-07-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240521 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251216 |