DE112022006171T5 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

Info

Publication number
DE112022006171T5
DE112022006171T5 DE112022006171.5T DE112022006171T DE112022006171T5 DE 112022006171 T5 DE112022006171 T5 DE 112022006171T5 DE 112022006171 T DE112022006171 T DE 112022006171T DE 112022006171 T5 DE112022006171 T5 DE 112022006171T5
Authority
DE
Germany
Prior art keywords
conductive
semiconductor device
metal
path
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022006171.5T
Other languages
German (de)
English (en)
Inventor
Tomohiro YASUNISHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022006171T5 publication Critical patent/DE112022006171T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112022006171.5T 2022-01-20 2022-12-23 Halbleitervorrichtung Pending DE112022006171T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-006874 2022-01-20
JP2022006874 2022-01-20
PCT/JP2022/047695 WO2023140050A1 (ja) 2022-01-20 2022-12-23 半導体装置

Publications (1)

Publication Number Publication Date
DE112022006171T5 true DE112022006171T5 (de) 2024-11-14

Family

ID=87348226

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022006171.5T Pending DE112022006171T5 (de) 2022-01-20 2022-12-23 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20240321693A1 (https=)
JP (1) JPWO2023140050A1 (https=)
CN (1) CN118613913A (https=)
DE (1) DE112022006171T5 (https=)
WO (1) WO2023140050A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025169688A1 (ja) * 2024-02-08 2025-08-14 ローム株式会社 半導体装置
WO2025177812A1 (ja) * 2024-02-20 2025-08-28 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005039135A (ja) * 2003-07-18 2005-02-10 Fuji Electric Holdings Co Ltd 半導体装置
JP2011222707A (ja) * 2010-04-08 2011-11-04 Mitsubishi Electric Corp 電力用半導体装置
JP2015069982A (ja) * 2013-09-26 2015-04-13 株式会社日立製作所 パワーモジュール
JP2021190505A (ja) * 2020-05-27 2021-12-13 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
US20240321693A1 (en) 2024-09-26
CN118613913A (zh) 2024-09-06
JPWO2023140050A1 (https=) 2023-07-27
WO2023140050A1 (ja) 2023-07-27

Similar Documents

Publication Publication Date Title
DE10310809B4 (de) Leistungshalbleitereinrichtung
DE102013207804B4 (de) Verfahren zum Herstellen eines Leistungsmoduls mit mittels Lichtbogenschweissen direkt verbundenen, wärmeleitenden Strukturen
DE102008051965B4 (de) Bauelement mit mehreren Halbleiterchips
DE112014001487B4 (de) Halbleitermodul
DE102007006447B4 (de) Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls
DE112007000919B4 (de) Gemeinsames Gehäuse für eine hohe Leistungsdichte aufweisende Bauteile, insbesondere für IGBTs und Dioden, mit niedriger Induktivität und drahtfreien Bondverbindungen
DE102014118836B4 (de) Halbleiter-packaging-anordnung und halbleiter-package
DE102013219571B4 (de) Leistungshalbleitermodul mit vertikalem Shunt-Widerstand
DE69216016T2 (de) Halbleiteranordnung
DE112023001614T5 (de) Halbleitervorrichtung
DE112020002520T5 (de) Halbleiterbauteil
DE112020003885T5 (de) Halbleiterbauteil
DE112021001035T5 (de) Halbleiterbauteil
DE102012200863A1 (de) Halbleitervorrichtung mit Grundplatte
DE112022006171T5 (de) Halbleitervorrichtung
DE112021001976T5 (de) Halbleiterbauteil
DE112018006370T5 (de) Halbleitereinrichtung
DE10393769T5 (de) Halbleitervorrichtung mit Klemmen zum Verbinden mit externen Elementen
DE112021002273T5 (de) Halbleiterbauteil
DE212021000219U1 (de) Elektronische Vorrichtung
DE112022002743T5 (de) Halbleitervorrichtung
DE102016223651A1 (de) Halbleitermodul und halbleitervorrichtung
DE112022002551T5 (de) Halbleiterbauteil
DE112022005176T5 (de) Halbleiterbauteil
WO2019063533A1 (de) Bauelement und verfahren zu dessen herstellung

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000