DE69216016T2 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE69216016T2 DE69216016T2 DE69216016T DE69216016T DE69216016T2 DE 69216016 T2 DE69216016 T2 DE 69216016T2 DE 69216016 T DE69216016 T DE 69216016T DE 69216016 T DE69216016 T DE 69216016T DE 69216016 T2 DE69216016 T2 DE 69216016T2
- Authority
- DE
- Germany
- Prior art keywords
- spring
- heat
- contacting
- inductance
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23350391 | 1991-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69216016D1 DE69216016D1 (de) | 1997-01-30 |
DE69216016T2 true DE69216016T2 (de) | 1997-04-03 |
Family
ID=16956050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69216016T Expired - Lifetime DE69216016T2 (de) | 1991-09-13 | 1992-09-04 | Halbleiteranordnung |
Country Status (3)
Country | Link |
---|---|
US (1) | US5247425A (de) |
EP (1) | EP0532244B1 (de) |
DE (1) | DE69216016T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005047547A1 (de) * | 2005-09-30 | 2007-04-19 | Siemens Ag | Andrückkonzept für Leistungsmodule bestehned aus mindestens einem "Direct Copper Bonding" (DCB) mit Leistungshalbleitern bestückt |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0634890B1 (de) * | 1993-07-12 | 1996-12-04 | Nec Corporation | Gehäusestruktur für Mikrowellenschaltung |
DE69531126T2 (de) * | 1994-04-22 | 2004-05-06 | Nec Corp. | Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen Element |
FR2732184B1 (fr) * | 1995-03-21 | 1997-04-30 | Asulab Sa | Module electrique de puissance |
US5965937A (en) * | 1997-12-15 | 1999-10-12 | Intel Corporation | Thermal interface attach mechanism for electrical packages |
US5933325A (en) * | 1998-06-17 | 1999-08-03 | Hon Hai Precision Ind. Co., Ltd. | Detachable fastening device for use with heat sink |
US5910884A (en) * | 1998-09-03 | 1999-06-08 | International Business Machines Corporation | Heatsink retention and air duct assembly |
DE19903245A1 (de) * | 1999-01-27 | 2000-08-03 | Asea Brown Boveri | Leistungshalbleitermodul |
US6226184B1 (en) * | 1999-10-22 | 2001-05-01 | Sun Microsystems, Inc. | Enclosure mounted heat sink |
US6867976B2 (en) * | 2002-02-12 | 2005-03-15 | Hewlett-Packard Development Company, L.P. | Pin retention for thermal transfer interfaces, and associated methods |
JP2003258178A (ja) * | 2002-02-27 | 2003-09-12 | Sanyo Electric Co Ltd | 半導体装置 |
EP1494279A1 (de) * | 2003-07-03 | 2005-01-05 | Siemens Aktiengesellschaft | Kühlende flexible Kontaktvorrichtung für einen Halbleiterchip |
US20060060328A1 (en) * | 2004-09-21 | 2006-03-23 | Ingo Ewes | Heat-transfer devices |
CN102065667B (zh) * | 2009-11-12 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | 电子装置及其散热装置 |
EP2467005A1 (de) | 2010-12-20 | 2012-06-20 | Vetco Gray Controls Limited | Kühlkomponente einer elektronischen Einheit |
FR2994333B1 (fr) * | 2012-08-03 | 2014-08-01 | Ge Energy Power Conversion Technology Ltd | Dispositif electronique semi-conducteur destine a etre monte dans un ensemble a empilement presse et ensemble a empilement presse comportant un tel dispositif |
DE102014114096A1 (de) * | 2014-09-29 | 2016-03-31 | Danfoss Silicon Power Gmbh | Sinterwerkzeug für den Unterstempel einer Sintervorrichtung |
DE102014114095B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Sintervorrichtung |
DE102014114093B4 (de) | 2014-09-29 | 2017-03-23 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
DE102014114097B4 (de) | 2014-09-29 | 2017-06-01 | Danfoss Silicon Power Gmbh | Sinterwerkzeug und Verfahren zum Sintern einer elektronischen Baugruppe |
US10980151B2 (en) * | 2018-07-31 | 2021-04-13 | Hewlett Packard Enterprise Development Lp | Flexible heat transfer mechanism configurations |
CN112490724B (zh) * | 2020-11-27 | 2023-02-03 | 株洲中车时代半导体有限公司 | 一种碟簧组件及功率半导体模块 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3401317A (en) * | 1966-07-11 | 1968-09-10 | Int Rectifier Corp | Fused semiconductor device |
US3717797A (en) * | 1971-03-19 | 1973-02-20 | Westinghouse Electric Corp | One piece aluminum electrical contact member for semiconductor devices |
US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
US4193445A (en) * | 1978-06-29 | 1980-03-18 | International Business Machines Corporation | Conduction cooled module |
US4769744A (en) * | 1983-08-04 | 1988-09-06 | General Electric Company | Semiconductor chip packages having solder layers of enhanced durability |
US4612601A (en) * | 1983-11-30 | 1986-09-16 | Nec Corporation | Heat dissipative integrated circuit chip package |
JPS63226952A (ja) * | 1987-03-16 | 1988-09-21 | Hitachi Ltd | 半導体装置 |
-
1992
- 1992-09-04 DE DE69216016T patent/DE69216016T2/de not_active Expired - Lifetime
- 1992-09-04 EP EP92308068A patent/EP0532244B1/de not_active Expired - Lifetime
- 1992-09-11 US US07/943,922 patent/US5247425A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005047547A1 (de) * | 2005-09-30 | 2007-04-19 | Siemens Ag | Andrückkonzept für Leistungsmodule bestehned aus mindestens einem "Direct Copper Bonding" (DCB) mit Leistungshalbleitern bestückt |
DE102005047547B4 (de) * | 2005-09-30 | 2008-02-14 | Siemens Ag | Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul |
Also Published As
Publication number | Publication date |
---|---|
DE69216016D1 (de) | 1997-01-30 |
EP0532244B1 (de) | 1996-12-18 |
EP0532244A1 (de) | 1993-03-17 |
US5247425A (en) | 1993-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJI ELECTRIC SYSTEMS CO., LTD., TOKYO/TOKIO, JP |