CN102065667B - 电子装置及其散热装置 - Google Patents

电子装置及其散热装置 Download PDF

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CN102065667B
CN102065667B CN200910309646.7A CN200910309646A CN102065667B CN 102065667 B CN102065667 B CN 102065667B CN 200910309646 A CN200910309646 A CN 200910309646A CN 102065667 B CN102065667 B CN 102065667B
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heat
radiator
conducting plate
heat abstractor
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CN102065667A (zh
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魏钊科
王文成
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Scienbizip Consulting Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种散热装置，用于对容置在一金属机壳内的电路板上的电子元件进行散热，该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片。本发明的散热装置与金属机壳之间通过弹片导热连接，不仅充分利用了金属机壳的辅助散热功能，解决了狭小体积的电子装置的散热问题，而且省去了在金属机壳与散热装置之间加垫其他导热介质，从而节省了成本。

Description

电子装置及其散热装置
技术领域
本发明涉及一种散热装置，特别涉及一种用来为电子装置散热的散热装置。
背景技术
现今，电脑、服务器(如各类刀锋伺服器)等电子装置的设计正朝高效能、薄型的方向发展，在电子装置有限的机壳空间内，堆置有更多的电子模组及各种元件，以服务更多更快的数据处理功能。这样一来，可为散热器预留的设计空间正在减小，造成散热器的散热能力也被相应削弱，进而导致电子装置内处理器因受限散热问题而无法充分发挥其效能，同时散热风扇也必须被维持在较高的转速下运行，整体消耗电能也因此提高。
发明内容
有鉴于此，实有必要提供一种电子装置及其散热装置，该散热装置可应用在电子装置狭小的机壳内，以解决电子装置的散热问题。
一种散热装置，用于对容置在一金属机壳内的电路板上的电子元件进行散热，该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片。
一种电子装置，包括一金属机壳及置于金属机壳内的一散热装置，该散热装置上固定有若干金属弹片，所述金属弹片与金属机壳内壁弹性接触。
与现有技术相比，本发明的散热装置与金属机壳之间通过弹片导热连接，不仅充分利用了金属机壳的辅助散热功能，解决了狭小体积的电子装置的散热问题，而且省去了在金属机壳与散热装置之间加垫其他导热介质，从而节省了成本。
下面参照附图结合实施例对本发明作进一步的描述。
附图说明
图1是本发明一实施例中散热装置的立体组装图。
图2是图2中散热装置的立体分解图。
图3是图2中散热装置的倒置图。
图4是应用图1中散热装置的一电子装置的截面示意图。
具体实施方式
请参照图1及图4，本发明一实施例的电子装置包括一金属机壳70、置于金属机壳70内的一散热装置及一电路板60。该散热装置用于对电路板60上的发热电子元件62散热，其包括一散热器及罩设该散热器的一罩体50。
请同时参照图2至图3，上述散热器包括一导热板10、一置于该导热板10底部的一吸热板20、置于导热板10四角处的四扣件30及置于导热板10顶部的一鳍片组40。
所述导热板10在一些实施例中由铜等金属材料制成，该导热板10底部中央开设一矩形槽14，所述吸热板20容置在槽14内，且吸热板20的底表面与其周围的导热板10的底表面平齐。该导热板10的四角落处开设有四通孔12，所述扣件30穿设该通孔12及电路板60将散热装置安装在电路板60上，以使吸热板20与电路板60上的电子元件62充分导热接触。该导热板10顶部中央开设一大致呈X形的容置槽16，该容置槽16可用来容置热管(图未示)。该容置槽16的中央与导热板10底部的槽14相连通，使吸热板20的顶表面能够与热管的底表面接触。
上述鳍片组40由若干鳍片42堆叠而成，该鳍片42由铜等金属材料制成。各鳍片42间隔排列，相邻的鳍片42间形成气流通道(未标号)。
在一些实施例中，上述罩体50由一金属片一体制成。该罩体50包括一矩形本体52及自本体52相对的两端边缘垂直向下延伸而成的二夹持部54。该二夹持部54贴设在鳍片组40最外侧的二鳍片42表面上，并将罩体50固定在鳍片组40上，使本体52的底表面与鳍片组40的各鳍片42末端导热接触。若干带状的弹片56自该本体52底部向上冲设形成。可选地，该弹片56可通过焊接等方式固定在罩体50的本体52上。可选地，该弹片56可直接固定在鳍片组40的鳍片42末端上。每一弹片56具有弧形截面，并相对于本体52顶表面凸出。各弹片56的顶端与金属机壳70弹性接触，这样电子元件62产生的热量可沿着吸热板20、鳍片组40及弹片56传导到金属机壳70，利用金属机壳70较大的表面积将热量散发掉。另外，由于金属机壳70与散热装置之间通过罩体50上凸起的弹片56弹性接触，从而省去了在金属机壳70与散热装置之间加垫其他板状的导热介质。并且因弹片56表面设计成圆弧形，从而可有效避免在安装散热装置的过程中刮伤金属机壳70表面的问题。
与现有技术相比，本发明的散热装置与金属机壳70之间通过弹片56导热连接，不仅充分利用了金属机壳70的辅助散热功能，解决了狭小体积的电子装置的散热问题，而且省去了在金属机壳70与散热装置之间加垫其他导热介质，从而节省了成本，同时还可有效避免在安装散热装置的过程中散热装置刮伤金属机壳70表面。

Claims (11)

1.一种散热装置，用于对容置在一金属机壳内的电路板上的电子元件进行散热，其特征在于：该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片，所述散热装置包括一散热器及罩设该散热器上的一罩体，所述散热器包括一导热板及一置于该导热板底部的一矩形吸热板，该导热板底部中央开设一矩形槽，该导热板顶部中央开设一用来容置热管的呈X形的容置槽，该容置槽中央与所述导热板底部的矩形槽相连通，所述吸热板容置在该矩形槽内并与电子组件导热接触。 
2.如权利要求1所述的散热装置，其特征在于：所述弹片固定连接在罩体上。 
3.如权利要求2所述的散热装置，其特征在于：所述罩体包括一本体及自本体相对端向下延伸而成的二夹持部，该二夹持部贴设在散热器的外侧表面上并将罩体固定在散热器上，所述弹片固定连接在本体上。 
4.如权利要求3所述的散热装置，其特征在于：所述弹片自该本体底部向上一体冲设而成。 
5.如权利要求3所述的散热装置，其特征在于：所述散热器包括多个鳍片，所述罩体的本体的底表面与散热器的各鳍片末端导热接触。 
6.如权利要求1所述的散热装置，其特征在于：所述弹片的截面为弧形，其朝向金属机壳凸出。 
7.一种电子装置，包括一金属机壳及置于金属机壳内的一散热装置，其特征在于：该散热装置上固定有若干金属弹片，所述金属弹片与金属机壳内壁弹性接触，所述散热装置包括一散热器及罩设该散热器上的一罩体，所述散热器包括一导热板及一置于该导热板底部的一矩形吸热板，该导热板底部中央开设一矩形槽，该导热板顶部中央开设一用来容置热管的呈X形的容置槽，该容置槽中央与所述导热板底部的矩形槽相连通，所述吸热板容置在该矩形槽内并与电子组件导热接触。 
8.如权利要求7所述的电子装置，其特征在于：所述金属弹片固定连接在罩体上。 
9.如权利要求8所述的电子装置，其特征在于：所述散热器包括多个鳍片，所述罩体罩于该多个鳍片上。 
10.如权利要求8所述的电子装置，其特征在于：所述罩体包括一本体及自本体相对端向下延伸而成的二夹持部，该二夹持部贴设在散热器的外侧表面上并将罩体固定在散热器上，所述弹片固定连接在本体上。 
11.如权利要求7-10中任一项所述的电子装置，其特征在于：所述弹片的截面为弧形，由本体向上朝金属机壳的方向一体冲设而成。 
CN200910309646.7A 2009-11-12 2009-11-12 电子装置及其散热装置 Expired - Fee Related CN102065667B (zh)

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