CN102065667B - 电子装置及其散热装置 - Google Patents

电子装置及其散热装置 Download PDF

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CN102065667B
CN102065667B CN200910309646.7A CN200910309646A CN102065667B CN 102065667 B CN102065667 B CN 102065667B CN 200910309646 A CN200910309646 A CN 200910309646A CN 102065667 B CN102065667 B CN 102065667B
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heat
cover
radiator
conducting plate
heat abstractor
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CN200910309646.7A
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CN102065667A (zh
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魏钊科
王文成
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赛恩倍吉科技顾问(深圳)有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种散热装置,用于对容置在一金属机壳内的电路板上的电子元件进行散热,该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片。本发明的散热装置与金属机壳之间通过弹片导热连接,不仅充分利用了金属机壳的辅助散热功能,解决了狭小体积的电子装置的散热问题,而且省去了在金属机壳与散热装置之间加垫其他导热介质,从而节省了成本。

Description

电子装置及其散热装置

技术领域

[0001] 本发明涉及一种散热装置,特别涉及一种用来为电子装置散热的散热装置。

背景技术

[0002] 现今,电脑、服务器(如各类刀锋伺服器)等电子装置的设计正朝高效能、薄型的方向发展,在电子装置有限的机壳空间内,堆置有更多的电子模组及各种元件,以服务更多更快的数据处理功能。这样一来,可为散热器预留的设计空间正在减小,造成散热器的散热能力也被相应削弱,进而导致电子装置内处理器因受限散热问题而无法充分发挥其效能,同时散热风扇也必须被维持在较高的转速下运行,整体消耗电能也因此提高。

发明内容

[0003] 有鉴于此,实有必要提供一种电子装置及其散热装置,该散热装置可应用在电子装置狭小的机壳内,以解决电子装置的散热问题。

[0004] 一种散热装置,用于对容置在一金属机壳内的电路板上的电子元件进行散热,该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片。

[0005] —种电子装置,包括一金属机壳及置于金属机壳内的一散热装置,该散热装置上固定有若干金属弹片,所述金属弹片与金属机壳内壁弹性接触。

[0006] 与现有技术相比,本发明的散热装置与金属机壳之间通过弹片导热连接,不仅充分利用了金属机壳的辅助散热功能,解决了狭小体积的电子装置的散热问题,而且省去了在金属机壳与散热装置之间加垫其他导热介质,从而节省了成本。

[0007] 下面参照附图结合实施例对本发明作进一步的描述。

附图说明

[0008] 图1是本发明一实施例中散热装置的立体组装图。

[0009] 图2是图2中散热装置的立体分解图。

[0010] 图3是图2中散热装置的倒置图。

[0011] 图4是应用图1中散热装置的一电子装置的截面示意图。

具体实施方式

[0012] 请参照图1及图4,本发明一实施例的电子装置包括一金属机壳70、置于金属机壳70内的一散热装置及一电路板60。该散热装置用于对电路板60上的发热电子兀件62散热,其包括一散热器及罩设该散热器的一罩体50。

[0013] 请同时参照图2至图3,上述散热器包括一导热板10、一置于该导热板10底部的一吸热板20、置于导热板10四角处的四扣件30及置于导热板10顶部的一鳍片组40。

[0014] 所述导热板10在一些实施例中由铜等金属材料制成,该导热板10底部中央开设一矩形槽14,所述吸热板20容置在槽14内,且吸热板20的底表面与其周围的导热板10的底表面平齐。该导热板10的四角落处开设有四通孔12,所述扣件30穿设该通孔12及电路板60将散热装置安装在电路板60上,以使吸热板20与电路板60上的电子元件62充分导热接触。该导热板10顶部中央开设一大致呈X形的容置槽16,该容置槽16可用来容置热管(图未不该容置槽16的中央与导热板10底部的槽14相连通,使吸热板20的顶表面能够与热管的底表面接触。

[0015] 上述鳍片组40由若干鳍片42堆叠而成,该鳍片42由铜等金属材料制成。各鳍片42间隔排列,相邻的鳍片42间形成气流通道(未标号)。

[0016] 在一些实施例中,上述罩体50由一金属片一体制成。该罩体50包括一矩形本体52及自本体52相对的两端边缘垂直向下延伸而成的二夹持部54。该二夹持部54贴设在鳍片组40最外侧的二鳍片42表面上,并将罩体50固定在鳍片组40上,使本体52的底表面与鳍片组40的各鳍片42末端导热接触。若干带状的弹片56自该本体52底部向上冲设形成。可选地,该弹片56可通过焊接等方式固定在罩体50的本体52上。可选地,该弹片56可直接固定在鳍片组40的鳍片42末端上。每一弹片56具有弧形截面,并相对于本体52顶表面凸出。各弹片56的顶端与金属机壳70弹性接触,这样电子元件62产生的热量可沿着吸热板20、鳍片组40及弹片56传导到金属机壳70,利用金属机壳70较大的表面积将热量散发掉。另外,由于金属机壳70与散热装置之间通过罩体50上凸起的弹片56弹性接触,从而省去了在金属机壳70与散热装置之间加垫其他板状的导热介质。并且因弹片56表面设计成圆弧形,从而可有效避免在安装散热装置的过程中刮伤金属机壳70表面的问题。

[0017] 与现有技术相比,本发明的散热装置与金属机壳70之间通过弹片56导热连接,不仅充分利用了金属机壳70的辅助散热功能,解决了狭小体积的电子装置的散热问题,而且省去了在金属机壳70与散热装置之间加垫其他导热介质,从而节省了成本,同时还可有效避免在安装散热装置的过程中散热装置刮伤金属机壳70表面。

Claims (11)

1.一种散热装置,用于对容置在一金属机壳内的电路板上的电子元件进行散热,其特征在于:该散热装置上固定有以与金属机壳内壁弹性接触的若干金属弹片,所述散热装置包括一散热器及罩设该散热器上的一罩体,所述散热器包括一导热板及一置于该导热板底部的一矩形吸热板,该导热板底部中央开设一矩形槽,该导热板顶部中央开设一用来容置热管的呈X形的容置槽,该容置槽中央与所述导热板底部的矩形槽相连通,所述吸热板容置在该矩形槽内并与电子组件导热接触。
2.如权利要求1所述的散热装置,其特征在于:所述弹片固定连接在罩体上。
3.如权利要求2所述的散热装置,其特征在于:所述罩体包括一本体及自本体相对端向下延伸而成的二夹持部,该二夹持部贴设在散热器的外侧表面上并将罩体固定在散热器上,所述弹片固定连接在本体上。
4.如权利要求3所述的散热装置,其特征在于:所述弹片自该本体底部向上一体冲设ίίϋ 。
5.如权利要求3所述的散热装置,其特征在于:所述散热器包括多个鳍片,所述罩体的本体的底表面与散热器的各鳍片末端导热接触。
6.如权利要求1所述的散热装置,其特征在于:所述弹片的截面为弧形,其朝向金属机壳凸出。
7.—种电子装置,包括一金属机壳及置于金属机壳内的一散热装置,其特征在于:该散热装置上固定有若干金属弹片,所述金属弹片与金属机壳内壁弹性接触,所述散热装置包括一散热器及罩设该散热器上的一罩体,所述散热器包括一导热板及一置于该导热板底部的一矩形吸热板,该导热板底部中央开设一矩形槽,该导热板顶部中央开设一用来容置热管的呈X形的容置槽,该容置槽中央与所述导热板底部的矩形槽相连通,所述吸热板容置在该矩形槽内并与电子组件导热接触。
8.如权利要求7所述的电子装置,其特征在于:所述金属弹片固定连接在罩体上。
9.如权利要求8所述的电子装置,其特征在于:所述散热器包括多个鳍片,所述罩体罩于该多个鳍片上。
10.如权利要求8所述的电子装置,其特征在于:所述罩体包括一本体及自本体相对端向下延伸而成的二夹持部,该二夹持部贴设在散热器的外侧表面上并将罩体固定在散热器上,所述弹片固定连接在本体上。
11.如权利要求7-10中任一项所述的电子装置,其特征在于:所述弹片的截面为弧形,由本体向上朝金属机壳的方向一体冲设而成。
CN200910309646.7A 2009-11-12 2009-11-12 电子装置及其散热装置 CN102065667B (zh)

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