IT201700024276A1 - Macchina elettrica - Google Patents

Macchina elettrica

Info

Publication number
IT201700024276A1
IT201700024276A1 IT102017000024276A IT201700024276A IT201700024276A1 IT 201700024276 A1 IT201700024276 A1 IT 201700024276A1 IT 102017000024276 A IT102017000024276 A IT 102017000024276A IT 201700024276 A IT201700024276 A IT 201700024276A IT 201700024276 A1 IT201700024276 A1 IT 201700024276A1
Authority
IT
Italy
Prior art keywords
electric machine
electric
machine
Prior art date
Application number
IT102017000024276A
Other languages
English (en)
Inventor
Filippis Pietro De
Original Assignee
Spal Automotive Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spal Automotive Srl filed Critical Spal Automotive Srl
Priority to IT102017000024276A priority Critical patent/IT201700024276A1/it
Priority to PCT/IB2018/051235 priority patent/WO2018158685A1/en
Priority to EP18709796.9A priority patent/EP3590179A1/en
Priority to CN201880015737.7A priority patent/CN110392971B/zh
Priority to US16/490,379 priority patent/US11349375B2/en
Publication of IT201700024276A1 publication Critical patent/IT201700024276A1/it

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/0094—Structural association with other electrical or electronic devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/18—Casings or enclosures characterised by the shape, form or construction thereof with ribs or fins for improving heat transfer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
    • H02K9/227—Heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
    • H02K2211/03—Machines characterised by circuit boards, e.g. pcb
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
IT102017000024276A 2017-03-03 2017-03-03 Macchina elettrica IT201700024276A1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT102017000024276A IT201700024276A1 (it) 2017-03-03 2017-03-03 Macchina elettrica
PCT/IB2018/051235 WO2018158685A1 (en) 2017-03-03 2018-02-27 Electrical machine
EP18709796.9A EP3590179A1 (en) 2017-03-03 2018-02-27 Electrical machine
CN201880015737.7A CN110392971B (zh) 2017-03-03 2018-02-27 电机
US16/490,379 US11349375B2 (en) 2017-03-03 2018-02-27 Electric machine with a heat transfer device for transferring heat from an electronic component to a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102017000024276A IT201700024276A1 (it) 2017-03-03 2017-03-03 Macchina elettrica

Publications (1)

Publication Number Publication Date
IT201700024276A1 true IT201700024276A1 (it) 2018-09-03

Family

ID=59253948

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000024276A IT201700024276A1 (it) 2017-03-03 2017-03-03 Macchina elettrica

Country Status (5)

Country Link
US (1) US11349375B2 (it)
EP (1) EP3590179A1 (it)
CN (1) CN110392971B (it)
IT (1) IT201700024276A1 (it)
WO (1) WO2018158685A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201700024276A1 (it) * 2017-03-03 2018-09-03 Spal Automotive Srl Macchina elettrica
TWI714479B (zh) * 2020-03-19 2020-12-21 車王電子股份有限公司 無刷馬達總成

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010013334A1 (de) * 2010-03-30 2012-05-10 Borgwarner Beru Systems Gmbh Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte
WO2014125412A1 (en) * 2013-02-14 2014-08-21 Spal Automotive S.R.L. Electrical machine

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007014713B3 (de) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung, Umrichter und elektrisches Antriebssystem
ITBO20070791A1 (it) 2007-11-30 2009-06-01 Spal Automotive Srl Macchina elettrica rotante e metodo di assemblaggio della stessa.
JP2009018417A (ja) * 2008-08-22 2009-01-29 Denso Corp 圧入材の圧入方法
CN102065667B (zh) * 2009-11-12 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 电子装置及其散热装置
TW201123410A (en) * 2009-12-25 2011-07-01 Bright Led Electronics Corp LED light-emitting module and its manufacturing method thereof.
ITBO20110413A1 (it) 2011-07-11 2013-01-12 Spal Automotive Srl Macchina elettrica rotante e relativo metodo di assemblaggio.
FR3020726B1 (fr) * 2014-05-05 2016-04-15 Valeo Equip Electr Moteur Ensemble electronique pour machine electrique tournante pour vehicule automobile
CN204652856U (zh) * 2015-05-25 2015-09-16 中兴通讯股份有限公司 一种散热装置
TWI588919B (zh) * 2016-03-04 2017-06-21 尼克森微電子股份有限公司 半導體封裝結構及其製造方法
FR3052610B1 (fr) * 2016-06-14 2021-12-03 Valeo Equip Electr Moteur Machine electrique tournante a electronique de puissance amelioree
IT201700024276A1 (it) * 2017-03-03 2018-09-03 Spal Automotive Srl Macchina elettrica

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010013334A1 (de) * 2010-03-30 2012-05-10 Borgwarner Beru Systems Gmbh Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte
WO2014125412A1 (en) * 2013-02-14 2014-08-21 Spal Automotive S.R.L. Electrical machine

Also Published As

Publication number Publication date
US20200076278A1 (en) 2020-03-05
US11349375B2 (en) 2022-05-31
WO2018158685A1 (en) 2018-09-07
CN110392971A (zh) 2019-10-29
EP3590179A1 (en) 2020-01-08
CN110392971B (zh) 2022-07-19

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