JPWO2024262253A5 - - Google Patents

Info

Publication number
JPWO2024262253A5
JPWO2024262253A5 JP2025527621A JP2025527621A JPWO2024262253A5 JP WO2024262253 A5 JPWO2024262253 A5 JP WO2024262253A5 JP 2025527621 A JP2025527621 A JP 2025527621A JP 2025527621 A JP2025527621 A JP 2025527621A JP WO2024262253 A5 JPWO2024262253 A5 JP WO2024262253A5
Authority
JP
Japan
Prior art keywords
electronic components
electronic device
wiring section
electronic
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527621A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024262253A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/019376 external-priority patent/WO2024262253A1/ja
Publication of JPWO2024262253A1 publication Critical patent/JPWO2024262253A1/ja
Publication of JPWO2024262253A5 publication Critical patent/JPWO2024262253A5/ja
Pending legal-status Critical Current

Links

JP2025527621A 2023-06-21 2024-05-27 Pending JPWO2024262253A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023101351 2023-06-21
PCT/JP2024/019376 WO2024262253A1 (ja) 2023-06-21 2024-05-27 電子装置

Publications (2)

Publication Number Publication Date
JPWO2024262253A1 JPWO2024262253A1 (https=) 2024-12-26
JPWO2024262253A5 true JPWO2024262253A5 (https=) 2026-03-23

Family

ID=93935499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527621A Pending JPWO2024262253A1 (https=) 2023-06-21 2024-05-27

Country Status (3)

Country Link
US (1) US20260107377A1 (https=)
JP (1) JPWO2024262253A1 (https=)
WO (1) WO2024262253A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63117454A (ja) * 1986-11-06 1988-05-21 Fujitsu Ltd 混成集積回路
JP3333355B2 (ja) * 1995-06-29 2002-10-15 株式会社東芝 半導体装置
JP2005101609A (ja) * 2003-09-23 2005-04-14 Samsung Electronics Co Ltd オンチップバイパスキャパシタの製造方法及びチップ
JP5516696B2 (ja) * 2012-11-01 2014-06-11 株式会社豊田自動織機 基板

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