JPWO2023058487A5 - - Google Patents
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- Publication number
- JPWO2023058487A5 JPWO2023058487A5 JP2023552807A JP2023552807A JPWO2023058487A5 JP WO2023058487 A5 JPWO2023058487 A5 JP WO2023058487A5 JP 2023552807 A JP2023552807 A JP 2023552807A JP 2023552807 A JP2023552807 A JP 2023552807A JP WO2023058487 A5 JPWO2023058487 A5 JP WO2023058487A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- exposed
- electronic device
- thickness direction
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021163439 | 2021-10-04 | ||
| PCT/JP2022/035702 WO2023058487A1 (ja) | 2021-10-04 | 2022-09-26 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058487A1 JPWO2023058487A1 (https=) | 2023-04-13 |
| JPWO2023058487A5 true JPWO2023058487A5 (https=) | 2024-06-25 |
Family
ID=85804238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552807A Pending JPWO2023058487A1 (https=) | 2021-10-04 | 2022-09-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240234230A1 (https=) |
| JP (1) | JPWO2023058487A1 (https=) |
| CN (1) | CN118056276A (https=) |
| DE (1) | DE112022004808T5 (https=) |
| WO (1) | WO2023058487A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4549318B2 (ja) * | 2006-06-29 | 2010-09-22 | アオイ電子株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5259978B2 (ja) | 2006-10-04 | 2013-08-07 | ローム株式会社 | 半導体装置の製造方法 |
| US10431532B2 (en) * | 2014-05-12 | 2019-10-01 | Rohm Co., Ltd. | Semiconductor device with notched main lead |
| JP7179526B2 (ja) * | 2018-08-10 | 2022-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| DE112020003122T5 (de) * | 2019-06-28 | 2022-05-05 | Rohm Co., Ltd. | Elektronikbauteil und elektronikbauteil-montagestruktur |
-
2022
- 2022-09-26 DE DE112022004808.5T patent/DE112022004808T5/de active Pending
- 2022-09-26 JP JP2023552807A patent/JPWO2023058487A1/ja active Pending
- 2022-09-26 WO PCT/JP2022/035702 patent/WO2023058487A1/ja not_active Ceased
- 2022-09-26 CN CN202280067219.6A patent/CN118056276A/zh active Pending
-
2024
- 2024-03-26 US US18/617,040 patent/US20240234230A1/en active Pending
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