JPWO2023058487A5 - - Google Patents

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Publication number
JPWO2023058487A5
JPWO2023058487A5 JP2023552807A JP2023552807A JPWO2023058487A5 JP WO2023058487 A5 JPWO2023058487 A5 JP WO2023058487A5 JP 2023552807 A JP2023552807 A JP 2023552807A JP 2023552807 A JP2023552807 A JP 2023552807A JP WO2023058487 A5 JPWO2023058487 A5 JP WO2023058487A5
Authority
JP
Japan
Prior art keywords
resin
exposed
electronic device
thickness direction
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023552807A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023058487A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/035702 external-priority patent/WO2023058487A1/ja
Publication of JPWO2023058487A1 publication Critical patent/JPWO2023058487A1/ja
Publication of JPWO2023058487A5 publication Critical patent/JPWO2023058487A5/ja
Pending legal-status Critical Current

Links

JP2023552807A 2021-10-04 2022-09-26 Pending JPWO2023058487A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021163439 2021-10-04
PCT/JP2022/035702 WO2023058487A1 (ja) 2021-10-04 2022-09-26 電子装置

Publications (2)

Publication Number Publication Date
JPWO2023058487A1 JPWO2023058487A1 (https=) 2023-04-13
JPWO2023058487A5 true JPWO2023058487A5 (https=) 2024-06-25

Family

ID=85804238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552807A Pending JPWO2023058487A1 (https=) 2021-10-04 2022-09-26

Country Status (5)

Country Link
US (1) US20240234230A1 (https=)
JP (1) JPWO2023058487A1 (https=)
CN (1) CN118056276A (https=)
DE (1) DE112022004808T5 (https=)
WO (1) WO2023058487A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4549318B2 (ja) * 2006-06-29 2010-09-22 アオイ電子株式会社 半導体装置および半導体装置の製造方法
JP5259978B2 (ja) 2006-10-04 2013-08-07 ローム株式会社 半導体装置の製造方法
JP6535509B2 (ja) * 2014-05-12 2019-06-26 ローム株式会社 半導体装置
JP7179526B2 (ja) * 2018-08-10 2022-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
WO2020262533A1 (ja) * 2019-06-28 2020-12-30 ローム株式会社 電子装置および電子装置の実装構造

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