JPWO2023042615A5 - - Google Patents

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Publication number
JPWO2023042615A5
JPWO2023042615A5 JP2023548379A JP2023548379A JPWO2023042615A5 JP WO2023042615 A5 JPWO2023042615 A5 JP WO2023042615A5 JP 2023548379 A JP2023548379 A JP 2023548379A JP 2023548379 A JP2023548379 A JP 2023548379A JP WO2023042615 A5 JPWO2023042615 A5 JP WO2023042615A5
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JP
Japan
Prior art keywords
wiring
electrode
thickness direction
main surface
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023548379A
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English (en)
Japanese (ja)
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JPWO2023042615A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/031725 external-priority patent/WO2023042615A1/ja
Publication of JPWO2023042615A1 publication Critical patent/JPWO2023042615A1/ja
Publication of JPWO2023042615A5 publication Critical patent/JPWO2023042615A5/ja
Pending legal-status Critical Current

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JP2023548379A 2021-09-14 2022-08-23 Pending JPWO2023042615A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021149234 2021-09-14
PCT/JP2022/031725 WO2023042615A1 (ja) 2021-09-14 2022-08-23 半導体装置、および半導体素子の実装構造

Publications (2)

Publication Number Publication Date
JPWO2023042615A1 JPWO2023042615A1 (https=) 2023-03-23
JPWO2023042615A5 true JPWO2023042615A5 (https=) 2024-06-05

Family

ID=85602739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023548379A Pending JPWO2023042615A1 (https=) 2021-09-14 2022-08-23

Country Status (6)

Country Link
US (1) US20240170353A1 (https=)
JP (1) JPWO2023042615A1 (https=)
CN (1) CN117957651A (https=)
DE (1) DE112022003964T5 (https=)
TW (1) TW202320600A (https=)
WO (1) WO2023042615A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247611A (ja) * 2003-02-14 2004-09-02 Matsushita Electric Works Ltd 半導体素子実装基板、半導体素子実装基板の製造方法
JP3919106B2 (ja) * 2003-02-17 2007-05-23 千住金属工業株式会社 ＣｕまたはＣｕ合金ボールの金属核はんだボール
KR102560697B1 (ko) * 2018-07-31 2023-07-27 삼성전자주식회사 인터포저를 가지는 반도체 패키지
CN109326571B (zh) * 2018-09-26 2020-12-29 矽力杰半导体技术(杭州)有限公司 芯片封装组件及其制造方法
CN109545754B (zh) * 2018-11-22 2021-01-26 京东方科技集团股份有限公司 一种芯片的封装结构、封装方法、显示装置
JP7312604B2 (ja) 2019-05-13 2023-07-21 ローム株式会社 半導体装置

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