JPWO2023162700A5 - - Google Patents
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- Publication number
- JPWO2023162700A5 JPWO2023162700A5 JP2024503008A JP2024503008A JPWO2023162700A5 JP WO2023162700 A5 JPWO2023162700 A5 JP WO2023162700A5 JP 2024503008 A JP2024503008 A JP 2024503008A JP 2024503008 A JP2024503008 A JP 2024503008A JP WO2023162700 A5 JPWO2023162700 A5 JP WO2023162700A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat dissipation
- semiconductor device
- main surface
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 25
- 230000017525 heat dissipation Effects 0.000 claims 18
- 239000004020 conductor Substances 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022027130 | 2022-02-24 | ||
| PCT/JP2023/004370 WO2023162700A1 (ja) | 2022-02-24 | 2023-02-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162700A1 JPWO2023162700A1 (https=) | 2023-08-31 |
| JPWO2023162700A5 true JPWO2023162700A5 (https=) | 2024-10-29 |
Family
ID=87765698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024503008A Pending JPWO2023162700A1 (https=) | 2022-02-24 | 2023-02-09 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240413049A1 (https=) |
| JP (1) | JPWO2023162700A1 (https=) |
| CN (1) | CN118805250A (https=) |
| WO (1) | WO2023162700A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6847266B2 (ja) * | 2017-12-20 | 2021-03-24 | 三菱電機株式会社 | 半導体パッケージおよびその製造方法 |
| JP2019212809A (ja) * | 2018-06-06 | 2019-12-12 | トヨタ自動車株式会社 | 半導体装置 |
| CN118213346A (zh) * | 2018-10-24 | 2024-06-18 | 罗姆股份有限公司 | 半导体装置 |
| JP2020096009A (ja) * | 2018-12-10 | 2020-06-18 | トヨタ自動車株式会社 | 半導体装置 |
-
2023
- 2023-02-09 JP JP2024503008A patent/JPWO2023162700A1/ja active Pending
- 2023-02-09 CN CN202380023144.6A patent/CN118805250A/zh active Pending
- 2023-02-09 WO PCT/JP2023/004370 patent/WO2023162700A1/ja not_active Ceased
-
2024
- 2024-08-15 US US18/805,794 patent/US20240413049A1/en active Pending
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