JP2019212809A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2019212809A JP2019212809A JP2018108913A JP2018108913A JP2019212809A JP 2019212809 A JP2019212809 A JP 2019212809A JP 2018108913 A JP2018108913 A JP 2018108913A JP 2018108913 A JP2018108913 A JP 2018108913A JP 2019212809 A JP2019212809 A JP 2019212809A
- Authority
- JP
- Japan
- Prior art keywords
- control circuit
- semiconductor element
- semiconductor device
- radiator plate
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
12:封止体
14、15、16:電力用端子
18:第1信号端子
19:第2信号端子
20:第1半導体素子
20a:第1半導体素子の表面電極
20b:第1半導体素子の裏面電極
20c:第1半導体素子の信号電極
22:上側放熱板
24:下側放熱板
26:上側放熱板の第1内側導体層
27:上側放熱板の第2内側導体層
28:上側放熱板の絶縁基板
30:上側放熱板の外側導体層
32:下側放熱板の第1内側導体層
33:下側放熱板の第2内側導体層
34:下側放熱板の絶縁基板
36:下側放熱板の外側導体層
38:継手
40:第2半導体素子
40a:第2半導体素子の表面電極
40b:第2半導体素子の裏面電極
40c:第2半導体素子の信号電極
42、44、46、48:はんだ層
50:第1制御回路
50A:第1制御回路エリア
52:第1制御回路の配線パターン
54:第1制御回路の駆動IC
56:第1制御回路のその他の素子
58:貫通孔
60:第2制御回路
60A:第2制御回路エリア
Claims (1)
- 表面電極、裏面電極及び信号電極を有する半導体素子と、
前記半導体素子を挟んで対向している上側放熱板及び下側放熱板と、
前記半導体素子の前記信号電極に電気的に接続されているとともに、前記上側放熱板又は前記下側放熱板に搭載された制御回路と、
を備え、
前記上側放熱板及び前記下側放熱板の各々は、絶縁基板と、前記絶縁基板の一方側に位置するととともに前記半導体素子の前記表面電極又は前記裏面電極へ電気的に接続された内側導体層と、前記絶縁基板の他方側に位置する外側導体層とを有し、
前記制御回路は、前記上側放熱板及び前記下側放熱板の一方に設けられているとともに、前記上側放熱板及び前記下側放熱板の他方と対向している、
半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108913A JP2019212809A (ja) | 2018-06-06 | 2018-06-06 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108913A JP2019212809A (ja) | 2018-06-06 | 2018-06-06 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019212809A true JP2019212809A (ja) | 2019-12-12 |
Family
ID=68845451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018108913A Pending JP2019212809A (ja) | 2018-06-06 | 2018-06-06 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2019212809A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113891509A (zh) * | 2020-07-01 | 2022-01-04 | 埃贝赫卡腾有限两合公司 | 电加热装置 |
WO2023162700A1 (ja) * | 2022-02-24 | 2023-08-31 | ローム株式会社 | 半導体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060091512A1 (en) * | 2004-11-01 | 2006-05-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing process thereof |
JP2010258135A (ja) * | 2009-04-23 | 2010-11-11 | Nippon Soken Inc | 電力変換用半導体装置 |
JP2011023654A (ja) * | 2009-07-17 | 2011-02-03 | Toyota Motor Corp | パワーモジュール |
JP2013041939A (ja) * | 2011-08-12 | 2013-02-28 | Sanyo Electric Co Ltd | 半導体モジュール及びそれを搭載したインバータ |
JP2014072384A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Motor Corp | 半導体装置 |
JP2016162777A (ja) * | 2015-02-26 | 2016-09-05 | 株式会社デンソー | 半導体装置及びその製造方法 |
-
2018
- 2018-06-06 JP JP2018108913A patent/JP2019212809A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060091512A1 (en) * | 2004-11-01 | 2006-05-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and manufacturing process thereof |
JP2006128555A (ja) * | 2004-11-01 | 2006-05-18 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
JP2010258135A (ja) * | 2009-04-23 | 2010-11-11 | Nippon Soken Inc | 電力変換用半導体装置 |
JP2011023654A (ja) * | 2009-07-17 | 2011-02-03 | Toyota Motor Corp | パワーモジュール |
JP2013041939A (ja) * | 2011-08-12 | 2013-02-28 | Sanyo Electric Co Ltd | 半導体モジュール及びそれを搭載したインバータ |
JP2014072384A (ja) * | 2012-09-28 | 2014-04-21 | Toyota Motor Corp | 半導体装置 |
JP2016162777A (ja) * | 2015-02-26 | 2016-09-05 | 株式会社デンソー | 半導体装置及びその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113891509A (zh) * | 2020-07-01 | 2022-01-04 | 埃贝赫卡腾有限两合公司 | 电加热装置 |
WO2023162700A1 (ja) * | 2022-02-24 | 2023-08-31 | ローム株式会社 | 半導体装置 |
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