JPWO2023112662A5 - - Google Patents
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- Publication number
- JPWO2023112662A5 JPWO2023112662A5 JP2023567659A JP2023567659A JPWO2023112662A5 JP WO2023112662 A5 JPWO2023112662 A5 JP WO2023112662A5 JP 2023567659 A JP2023567659 A JP 2023567659A JP 2023567659 A JP2023567659 A JP 2023567659A JP WO2023112662 A5 JPWO2023112662 A5 JP WO2023112662A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness direction
- electrode
- module according
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 30
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000007790 solid phase Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021204569 | 2021-12-16 | ||
| PCT/JP2022/043948 WO2023112662A1 (ja) | 2021-12-16 | 2022-11-29 | 半導体モジュールおよび半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023112662A1 JPWO2023112662A1 (https=) | 2023-06-22 |
| JPWO2023112662A5 true JPWO2023112662A5 (https=) | 2024-08-28 |
Family
ID=86774239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567659A Pending JPWO2023112662A1 (https=) | 2021-12-16 | 2022-11-29 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240321699A1 (https=) |
| JP (1) | JPWO2023112662A1 (https=) |
| CN (1) | CN118435347A (https=) |
| DE (1) | DE112022004864T5 (https=) |
| WO (1) | WO2023112662A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025249259A1 (ja) * | 2024-05-31 | 2025-12-04 | ローム株式会社 | 半導体装置 |
| WO2026042579A1 (ja) * | 2024-08-22 | 2026-02-26 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258387A (ja) | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP6610101B2 (ja) * | 2015-09-08 | 2019-11-27 | 株式会社村田製作所 | 半導体モジュール |
| JP6805768B2 (ja) * | 2016-12-02 | 2020-12-23 | アイシン精機株式会社 | 半導体装置 |
| JP2021125624A (ja) * | 2020-02-07 | 2021-08-30 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-29 JP JP2023567659A patent/JPWO2023112662A1/ja active Pending
- 2022-11-29 WO PCT/JP2022/043948 patent/WO2023112662A1/ja not_active Ceased
- 2022-11-29 CN CN202280081737.3A patent/CN118435347A/zh active Pending
- 2022-11-29 DE DE112022004864.6T patent/DE112022004864T5/de active Pending
-
2024
- 2024-06-04 US US18/733,196 patent/US20240321699A1/en active Pending
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