JPWO2023112662A1 - - Google Patents
Info
- Publication number
- JPWO2023112662A1 JPWO2023112662A1 JP2023567659A JP2023567659A JPWO2023112662A1 JP WO2023112662 A1 JPWO2023112662 A1 JP WO2023112662A1 JP 2023567659 A JP2023567659 A JP 2023567659A JP 2023567659 A JP2023567659 A JP 2023567659A JP WO2023112662 A1 JPWO2023112662 A1 JP WO2023112662A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/465—Bumps or wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021204569 | 2021-12-16 | ||
| PCT/JP2022/043948 WO2023112662A1 (ja) | 2021-12-16 | 2022-11-29 | 半導体モジュールおよび半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023112662A1 true JPWO2023112662A1 (https=) | 2023-06-22 |
| JPWO2023112662A5 JPWO2023112662A5 (https=) | 2024-08-28 |
Family
ID=86774239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567659A Pending JPWO2023112662A1 (https=) | 2021-12-16 | 2022-11-29 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240321699A1 (https=) |
| JP (1) | JPWO2023112662A1 (https=) |
| CN (1) | CN118435347A (https=) |
| DE (1) | DE112022004864T5 (https=) |
| WO (1) | WO2023112662A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025249259A1 (ja) * | 2024-05-31 | 2025-12-04 | ローム株式会社 | 半導体装置 |
| WO2026042579A1 (ja) * | 2024-08-22 | 2026-02-26 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258387A (ja) | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP6610101B2 (ja) * | 2015-09-08 | 2019-11-27 | 株式会社村田製作所 | 半導体モジュール |
| JP6805768B2 (ja) * | 2016-12-02 | 2020-12-23 | アイシン精機株式会社 | 半導体装置 |
| JP2021125624A (ja) * | 2020-02-07 | 2021-08-30 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-29 DE DE112022004864.6T patent/DE112022004864T5/de active Pending
- 2022-11-29 CN CN202280081737.3A patent/CN118435347A/zh active Pending
- 2022-11-29 WO PCT/JP2022/043948 patent/WO2023112662A1/ja not_active Ceased
- 2022-11-29 JP JP2023567659A patent/JPWO2023112662A1/ja active Pending
-
2024
- 2024-06-04 US US18/733,196 patent/US20240321699A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240321699A1 (en) | 2024-09-26 |
| WO2023112662A1 (ja) | 2023-06-22 |
| DE112022004864T5 (de) | 2024-07-25 |
| CN118435347A (zh) | 2024-08-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240517 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251119 |