DE112022004864T5 - Halbleitermodul und halbleiterbauteil - Google Patents

Halbleitermodul und halbleiterbauteil Download PDF

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Publication number
DE112022004864T5
DE112022004864T5 DE112022004864.6T DE112022004864T DE112022004864T5 DE 112022004864 T5 DE112022004864 T5 DE 112022004864T5 DE 112022004864 T DE112022004864 T DE 112022004864T DE 112022004864 T5 DE112022004864 T5 DE 112022004864T5
Authority
DE
Germany
Prior art keywords
layer
thickness direction
electrode
semiconductor
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022004864.6T
Other languages
German (de)
English (en)
Inventor
Yo Mochizuki
Kazunori Fuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022004864T5 publication Critical patent/DE112022004864T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112022004864.6T 2021-12-16 2022-11-29 Halbleitermodul und halbleiterbauteil Pending DE112022004864T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-204569 2021-12-16
JP2021204569 2021-12-16
PCT/JP2022/043948 WO2023112662A1 (ja) 2021-12-16 2022-11-29 半導体モジュールおよび半導体装置

Publications (1)

Publication Number Publication Date
DE112022004864T5 true DE112022004864T5 (de) 2024-07-25

Family

ID=86774239

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022004864.6T Pending DE112022004864T5 (de) 2021-12-16 2022-11-29 Halbleitermodul und halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240321699A1 (https=)
JP (1) JPWO2023112662A1 (https=)
CN (1) CN118435347A (https=)
DE (1) DE112022004864T5 (https=)
WO (1) WO2023112662A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249259A1 (ja) * 2024-05-31 2025-12-04 ローム株式会社 半導体装置
WO2026042579A1 (ja) * 2024-08-22 2026-02-26 ローム株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6610101B2 (ja) * 2015-09-08 2019-11-27 株式会社村田製作所 半導体モジュール
JP6805768B2 (ja) * 2016-12-02 2020-12-23 アイシン精機株式会社 半導体装置
JP2021125624A (ja) * 2020-02-07 2021-08-30 ローム株式会社 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置

Also Published As

Publication number Publication date
WO2023112662A1 (ja) 2023-06-22
CN118435347A (zh) 2024-08-02
JPWO2023112662A1 (https=) 2023-06-22
US20240321699A1 (en) 2024-09-26

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023367000

Ipc: H10W0040220000