CN118435347A - 半导体模块以及半导体装置 - Google Patents

半导体模块以及半导体装置 Download PDF

Info

Publication number
CN118435347A
CN118435347A CN202280081737.3A CN202280081737A CN118435347A CN 118435347 A CN118435347 A CN 118435347A CN 202280081737 A CN202280081737 A CN 202280081737A CN 118435347 A CN118435347 A CN 118435347A
Authority
CN
China
Prior art keywords
layer
electrode
thickness direction
semiconductor
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280081737.3A
Other languages
English (en)
Chinese (zh)
Inventor
望月阳
富士和则
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118435347A publication Critical patent/CN118435347A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280081737.3A 2021-12-16 2022-11-29 半导体模块以及半导体装置 Pending CN118435347A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-204569 2021-12-16
JP2021204569 2021-12-16
PCT/JP2022/043948 WO2023112662A1 (ja) 2021-12-16 2022-11-29 半導体モジュールおよび半導体装置

Publications (1)

Publication Number Publication Date
CN118435347A true CN118435347A (zh) 2024-08-02

Family

ID=86774239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280081737.3A Pending CN118435347A (zh) 2021-12-16 2022-11-29 半导体模块以及半导体装置

Country Status (5)

Country Link
US (1) US20240321699A1 (https=)
JP (1) JPWO2023112662A1 (https=)
CN (1) CN118435347A (https=)
DE (1) DE112022004864T5 (https=)
WO (1) WO2023112662A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249259A1 (ja) * 2024-05-31 2025-12-04 ローム株式会社 半導体装置
WO2026042579A1 (ja) * 2024-08-22 2026-02-26 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
JP6610101B2 (ja) * 2015-09-08 2019-11-27 株式会社村田製作所 半導体モジュール
JP6805768B2 (ja) * 2016-12-02 2020-12-23 アイシン精機株式会社 半導体装置
JP2021125624A (ja) * 2020-02-07 2021-08-30 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023112662A1 (ja) 2023-06-22
JPWO2023112662A1 (https=) 2023-06-22
DE112022004864T5 (de) 2024-07-25
US20240321699A1 (en) 2024-09-26

Similar Documents

Publication Publication Date Title
KR100616129B1 (ko) 고 전력 ｍｃｍ 패키지
KR100430772B1 (ko) 반도체장치
US11456244B2 (en) Semiconductor device
US20240404977A1 (en) Semiconductor device and semiconductor module
US20240014193A1 (en) Semiconductor device
US20240321699A1 (en) Semiconductor module and semiconductor device
CN117529808A (zh) 半导体装置
JP2023088628A (ja) 半導体装置
CN113287195B (zh) 半导体装置
US20240030080A1 (en) Semiconductor device
WO2023149257A1 (ja) 半導体装置
WO2022074971A1 (ja) 半導体装置
US20240282681A1 (en) Semiconductor device, and semiconductor device mounting body
US20250167163A1 (en) Semiconductor device
WO2024106219A1 (ja) 半導体装置
WO2023120353A1 (ja) 半導体装置
CN118435350A (zh) 半导体装置
CN119816946A (zh) 半导体装置
CN118103973A (zh) 半导体装置
WO2025249259A1 (ja) 半導体装置
WO2023199808A1 (ja) 半導体装置
CN117999650A (zh) 半导体装置
WO2023218943A1 (ja) 半導体装置
CN117280458A (zh) 半导体装置
CN118805250A (zh) 半导体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination