JPWO2024116743A5 - - Google Patents

Info

Publication number
JPWO2024116743A5
JPWO2024116743A5 JP2024561286A JP2024561286A JPWO2024116743A5 JP WO2024116743 A5 JPWO2024116743 A5 JP WO2024116743A5 JP 2024561286 A JP2024561286 A JP 2024561286A JP 2024561286 A JP2024561286 A JP 2024561286A JP WO2024116743 A5 JPWO2024116743 A5 JP WO2024116743A5
Authority
JP
Japan
Prior art keywords
thickness direction
semiconductor device
insulating layer
heat dissipation
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024561286A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024116743A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/040000 external-priority patent/WO2024116743A1/ja
Publication of JPWO2024116743A1 publication Critical patent/JPWO2024116743A1/ja
Publication of JPWO2024116743A5 publication Critical patent/JPWO2024116743A5/ja
Pending legal-status Critical Current

Links

JP2024561286A 2022-12-02 2023-11-07 Pending JPWO2024116743A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022193471 2022-12-02
PCT/JP2023/040000 WO2024116743A1 (ja) 2022-12-02 2023-11-07 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024116743A1 JPWO2024116743A1 (https=) 2024-06-06
JPWO2024116743A5 true JPWO2024116743A5 (https=) 2025-08-08

Family

ID=91323373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024561286A Pending JPWO2024116743A1 (https=) 2022-12-02 2023-11-07

Country Status (2)

Country Link
JP (1) JPWO2024116743A1 (https=)
WO (1) WO2024116743A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5565147B2 (ja) * 2010-06-30 2014-08-06 株式会社デンソー 半導体モジュールの製造方法
JP5434986B2 (ja) * 2011-08-10 2014-03-05 株式会社デンソー 半導体モジュールおよびそれを備えた半導体装置
JP2015056638A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体装置およびその製造方法
JP7267716B2 (ja) * 2018-11-12 2023-05-02 ローム株式会社 半導体装置
IT202000016840A1 (it) * 2020-07-10 2022-01-10 St Microelectronics Srl Dispositivo mosfet incapsulato ad alta tensione e dotato di clip di connessione e relativo procedimento di fabbricazione

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