JPWO2024116743A1 - - Google Patents
Info
- Publication number
- JPWO2024116743A1 JPWO2024116743A1 JP2024561286A JP2024561286A JPWO2024116743A1 JP WO2024116743 A1 JPWO2024116743 A1 JP WO2024116743A1 JP 2024561286 A JP2024561286 A JP 2024561286A JP 2024561286 A JP2024561286 A JP 2024561286A JP WO2024116743 A1 JPWO2024116743 A1 JP WO2024116743A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022193471 | 2022-12-02 | ||
| PCT/JP2023/040000 WO2024116743A1 (ja) | 2022-12-02 | 2023-11-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024116743A1 true JPWO2024116743A1 (https=) | 2024-06-06 |
| JPWO2024116743A5 JPWO2024116743A5 (https=) | 2025-08-08 |
Family
ID=91323373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024561286A Pending JPWO2024116743A1 (https=) | 2022-12-02 | 2023-11-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024116743A1 (https=) |
| WO (1) | WO2024116743A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565147B2 (ja) * | 2010-06-30 | 2014-08-06 | 株式会社デンソー | 半導体モジュールの製造方法 |
| JP5434986B2 (ja) * | 2011-08-10 | 2014-03-05 | 株式会社デンソー | 半導体モジュールおよびそれを備えた半導体装置 |
| JP2015056638A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP7267716B2 (ja) * | 2018-11-12 | 2023-05-02 | ローム株式会社 | 半導体装置 |
| IT202000016840A1 (it) * | 2020-07-10 | 2022-01-10 | St Microelectronics Srl | Dispositivo mosfet incapsulato ad alta tensione e dotato di clip di connessione e relativo procedimento di fabbricazione |
-
2023
- 2023-11-07 JP JP2024561286A patent/JPWO2024116743A1/ja active Pending
- 2023-11-07 WO PCT/JP2023/040000 patent/WO2024116743A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024116743A1 (ja) | 2024-06-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250409 |