JPWO2022259825A5 - - Google Patents

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Publication number
JPWO2022259825A5
JPWO2022259825A5 JP2023527588A JP2023527588A JPWO2022259825A5 JP WO2022259825 A5 JPWO2022259825 A5 JP WO2022259825A5 JP 2023527588 A JP2023527588 A JP 2023527588A JP 2023527588 A JP2023527588 A JP 2023527588A JP WO2022259825 A5 JPWO2022259825 A5 JP WO2022259825A5
Authority
JP
Japan
Prior art keywords
layer
metal layer
semiconductor device
edge
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023527588A
Other languages
English (en)
Japanese (ja)
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JPWO2022259825A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/020468 external-priority patent/WO2022259825A1/ja
Publication of JPWO2022259825A1 publication Critical patent/JPWO2022259825A1/ja
Publication of JPWO2022259825A5 publication Critical patent/JPWO2022259825A5/ja
Pending legal-status Critical Current

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JP2023527588A 2021-06-09 2022-05-17 Pending JPWO2022259825A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021096764 2021-06-09
PCT/JP2022/020468 WO2022259825A1 (ja) 2021-06-09 2022-05-17 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022259825A1 JPWO2022259825A1 (https=) 2022-12-15
JPWO2022259825A5 true JPWO2022259825A5 (https=) 2025-04-15

Family

ID=84424843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023527588A Pending JPWO2022259825A1 (https=) 2021-06-09 2022-05-17

Country Status (5)

Country Link
US (1) US20240047300A1 (https=)
JP (1) JPWO2022259825A1 (https=)
CN (1) CN117425960A (https=)
DE (1) DE112022002542T5 (https=)
WO (1) WO2022259825A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6142584B2 (ja) * 2013-03-08 2017-06-07 三菱マテリアル株式会社 金属複合体、回路基板、半導体装置、及び金属複合体の製造方法
JP7020325B2 (ja) * 2018-07-12 2022-02-16 三菱電機株式会社 半導体装置、電力変換装置、及び半導体装置の製造方法
US12506123B2 (en) * 2019-05-24 2025-12-23 Rohm Co., Ltd. Semiconductor device

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