JPWO2023243278A5 - - Google Patents

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Publication number
JPWO2023243278A5
JPWO2023243278A5 JP2024528386A JP2024528386A JPWO2023243278A5 JP WO2023243278 A5 JPWO2023243278 A5 JP WO2023243278A5 JP 2024528386 A JP2024528386 A JP 2024528386A JP 2024528386 A JP2024528386 A JP 2024528386A JP WO2023243278 A5 JPWO2023243278 A5 JP WO2023243278A5
Authority
JP
Japan
Prior art keywords
recess
semiconductor device
main surface
semiconductor element
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528386A
Other languages
English (en)
Japanese (ja)
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JPWO2023243278A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/017927 external-priority patent/WO2023243278A1/ja
Publication of JPWO2023243278A1 publication Critical patent/JPWO2023243278A1/ja
Publication of JPWO2023243278A5 publication Critical patent/JPWO2023243278A5/ja
Pending legal-status Critical Current

Links

JP2024528386A 2022-06-14 2023-05-12 Pending JPWO2023243278A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022095937 2022-06-14
PCT/JP2023/017927 WO2023243278A1 (ja) 2022-06-14 2023-05-12 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023243278A1 JPWO2023243278A1 (https=) 2023-12-21
JPWO2023243278A5 true JPWO2023243278A5 (https=) 2025-02-25

Family

ID=89191135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528386A Pending JPWO2023243278A1 (https=) 2022-06-14 2023-05-12

Country Status (3)

Country Link
US (1) US20250105109A1 (https=)
JP (1) JPWO2023243278A1 (https=)
WO (1) WO2023243278A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026023536A1 (ja) * 2024-07-26 2026-01-29 ローム株式会社 半導体装置および半導体装置アッセンブリ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8466548B2 (en) * 2011-05-31 2013-06-18 Infineon Technologies Ag Semiconductor device including excess solder
JP2014203930A (ja) * 2013-04-03 2014-10-27 株式会社デンソー モールドパッケージ
JP2014216459A (ja) * 2013-04-25 2014-11-17 三菱電機株式会社 半導体装置
JP6572732B2 (ja) * 2015-10-27 2019-09-11 三菱マテリアル株式会社 パワーモジュール
JP2017098314A (ja) * 2015-11-19 2017-06-01 Tdk株式会社 電子機器
CN114026687B (zh) * 2020-01-07 2026-02-17 富士电机株式会社 半导体装置
US12557685B2 (en) * 2020-03-25 2026-02-17 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device

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