JPWO2023243278A1 - - Google Patents
Info
- Publication number
- JPWO2023243278A1 JPWO2023243278A1 JP2024528386A JP2024528386A JPWO2023243278A1 JP WO2023243278 A1 JPWO2023243278 A1 JP WO2023243278A1 JP 2024528386 A JP2024528386 A JP 2024528386A JP 2024528386 A JP2024528386 A JP 2024528386A JP WO2023243278 A1 JPWO2023243278 A1 JP WO2023243278A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022095937 | 2022-06-14 | ||
| PCT/JP2023/017927 WO2023243278A1 (ja) | 2022-06-14 | 2023-05-12 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023243278A1 true JPWO2023243278A1 (https=) | 2023-12-21 |
| JPWO2023243278A5 JPWO2023243278A5 (https=) | 2025-02-25 |
Family
ID=89191135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528386A Pending JPWO2023243278A1 (https=) | 2022-06-14 | 2023-05-12 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250105109A1 (https=) |
| JP (1) | JPWO2023243278A1 (https=) |
| WO (1) | WO2023243278A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026023536A1 (ja) * | 2024-07-26 | 2026-01-29 | ローム株式会社 | 半導体装置および半導体装置アッセンブリ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8466548B2 (en) * | 2011-05-31 | 2013-06-18 | Infineon Technologies Ag | Semiconductor device including excess solder |
| JP2014203930A (ja) * | 2013-04-03 | 2014-10-27 | 株式会社デンソー | モールドパッケージ |
| JP2014216459A (ja) * | 2013-04-25 | 2014-11-17 | 三菱電機株式会社 | 半導体装置 |
| JP6572732B2 (ja) * | 2015-10-27 | 2019-09-11 | 三菱マテリアル株式会社 | パワーモジュール |
| JP2017098314A (ja) * | 2015-11-19 | 2017-06-01 | Tdk株式会社 | 電子機器 |
| DE112020002845T5 (de) * | 2020-01-07 | 2022-03-03 | Fuji Electric Co., Ltd. | Halbleitervorrichtung |
| CN115335983A (zh) * | 2020-03-25 | 2022-11-11 | 罗姆股份有限公司 | 半导体器件及半导体器件的制造方法 |
-
2023
- 2023-05-12 JP JP2024528386A patent/JPWO2023243278A1/ja active Pending
- 2023-05-12 WO PCT/JP2023/017927 patent/WO2023243278A1/ja not_active Ceased
-
2024
- 2024-12-09 US US18/974,221 patent/US20250105109A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023243278A1 (ja) | 2023-12-21 |
| US20250105109A1 (en) | 2025-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241115 |