JPWO2025027845A1 - - Google Patents
Info
- Publication number
- JPWO2025027845A1 JPWO2025027845A1 JP2025538160A JP2025538160A JPWO2025027845A1 JP WO2025027845 A1 JPWO2025027845 A1 JP WO2025027845A1 JP 2025538160 A JP2025538160 A JP 2025538160A JP 2025538160 A JP2025538160 A JP 2025538160A JP WO2025027845 A1 JPWO2025027845 A1 JP WO2025027845A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/028403 WO2025027845A1 (ja) | 2023-08-03 | 2023-08-03 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025027845A1 true JPWO2025027845A1 (https=) | 2025-02-06 |
| JPWO2025027845A5 JPWO2025027845A5 (https=) | 2025-09-18 |
Family
ID=94394909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025538160A Pending JPWO2025027845A1 (https=) | 2023-08-03 | 2023-08-03 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2025027845A1 (https=) |
| CN (1) | CN121621055A (https=) |
| WO (1) | WO2025027845A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4969738B2 (ja) * | 2001-06-28 | 2012-07-04 | 株式会社東芝 | セラミックス回路基板およびそれを用いた半導体モジュール |
| JP2004158613A (ja) * | 2002-11-06 | 2004-06-03 | Nissan Motor Co Ltd | 半導体装置 |
| JP2014216459A (ja) * | 2013-04-25 | 2014-11-17 | 三菱電機株式会社 | 半導体装置 |
| JP2016143846A (ja) * | 2015-02-05 | 2016-08-08 | 三菱電機株式会社 | 半導体装置 |
| JP2017017297A (ja) * | 2015-07-07 | 2017-01-19 | 株式会社リコー | 半導体装置及びレーザ装置 |
| CN118098990A (zh) * | 2017-03-23 | 2024-05-28 | 株式会社东芝 | 陶瓷金属电路基板的制造方法及使用了该陶瓷金属电路基板的半导体装置 |
| JP6601512B2 (ja) * | 2018-01-24 | 2019-11-06 | 三菱マテリアル株式会社 | ヒートシンク付きパワーモジュール用基板及びパワーモジュール |
| JP7424026B2 (ja) * | 2019-12-13 | 2024-01-30 | 三菱マテリアル株式会社 | 絶縁回路基板 |
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2023
- 2023-08-03 CN CN202380100710.9A patent/CN121621055A/zh active Pending
- 2023-08-03 JP JP2025538160A patent/JPWO2025027845A1/ja active Pending
- 2023-08-03 WO PCT/JP2023/028403 patent/WO2025027845A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN121621055A (zh) | 2026-03-06 |
| WO2025027845A1 (ja) | 2025-02-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250708 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250708 |