CN121621055A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法

Info

Publication number
CN121621055A
CN121621055A CN202380100710.9A CN202380100710A CN121621055A CN 121621055 A CN121621055 A CN 121621055A CN 202380100710 A CN202380100710 A CN 202380100710A CN 121621055 A CN121621055 A CN 121621055A
Authority
CN
China
Prior art keywords
slit
pattern
semiconductor device
insulating substrate
surface pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380100710.9A
Other languages
English (en)
Chinese (zh)
Inventor
吉松直树
河面英夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN121621055A publication Critical patent/CN121621055A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380100710.9A 2023-08-03 2023-08-03 半导体装置及半导体装置的制造方法 Pending CN121621055A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/028403 WO2025027845A1 (ja) 2023-08-03 2023-08-03 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN121621055A true CN121621055A (zh) 2026-03-06

Family

ID=94394909

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380100710.9A Pending CN121621055A (zh) 2023-08-03 2023-08-03 半导体装置及半导体装置的制造方法

Country Status (3)

Country Link
JP (1) JPWO2025027845A1 (https=)
CN (1) CN121621055A (https=)
WO (1) WO2025027845A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
JP2004158613A (ja) * 2002-11-06 2004-06-03 Nissan Motor Co Ltd 半導体装置
JP2014216459A (ja) * 2013-04-25 2014-11-17 三菱電機株式会社 半導体装置
JP2016143846A (ja) * 2015-02-05 2016-08-08 三菱電機株式会社 半導体装置
JP2017017297A (ja) * 2015-07-07 2017-01-19 株式会社リコー 半導体装置及びレーザ装置
CN118098990A (zh) * 2017-03-23 2024-05-28 株式会社东芝 陶瓷金属电路基板的制造方法及使用了该陶瓷金属电路基板的半导体装置
JP6601512B2 (ja) * 2018-01-24 2019-11-06 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
JP7424026B2 (ja) * 2019-12-13 2024-01-30 三菱マテリアル株式会社 絶縁回路基板

Also Published As

Publication number Publication date
WO2025027845A1 (ja) 2025-02-06
JPWO2025027845A1 (https=) 2025-02-06

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