JPWO2025027845A5 - - Google Patents

Info

Publication number
JPWO2025027845A5
JPWO2025027845A5 JP2025538160A JP2025538160A JPWO2025027845A5 JP WO2025027845 A5 JPWO2025027845 A5 JP WO2025027845A5 JP 2025538160 A JP2025538160 A JP 2025538160A JP 2025538160 A JP2025538160 A JP 2025538160A JP WO2025027845 A5 JPWO2025027845 A5 JP WO2025027845A5
Authority
JP
Japan
Prior art keywords
slit
surface pattern
semiconductor device
insulating layer
rear surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025538160A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025027845A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/028403 external-priority patent/WO2025027845A1/ja
Publication of JPWO2025027845A1 publication Critical patent/JPWO2025027845A1/ja
Publication of JPWO2025027845A5 publication Critical patent/JPWO2025027845A5/ja
Pending legal-status Critical Current

Links

JP2025538160A 2023-08-03 2023-08-03 Pending JPWO2025027845A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/028403 WO2025027845A1 (ja) 2023-08-03 2023-08-03 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025027845A1 JPWO2025027845A1 (https=) 2025-02-06
JPWO2025027845A5 true JPWO2025027845A5 (https=) 2025-09-18

Family

ID=94394909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025538160A Pending JPWO2025027845A1 (https=) 2023-08-03 2023-08-03

Country Status (3)

Country Link
JP (1) JPWO2025027845A1 (https=)
CN (1) CN121621055A (https=)
WO (1) WO2025027845A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
JP2004158613A (ja) * 2002-11-06 2004-06-03 Nissan Motor Co Ltd 半導体装置
JP2014216459A (ja) * 2013-04-25 2014-11-17 三菱電機株式会社 半導体装置
JP2016143846A (ja) * 2015-02-05 2016-08-08 三菱電機株式会社 半導体装置
JP2017017297A (ja) * 2015-07-07 2017-01-19 株式会社リコー 半導体装置及びレーザ装置
CN118098990A (zh) * 2017-03-23 2024-05-28 株式会社东芝 陶瓷金属电路基板的制造方法及使用了该陶瓷金属电路基板的半导体装置
JP6601512B2 (ja) * 2018-01-24 2019-11-06 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
JP7424026B2 (ja) * 2019-12-13 2024-01-30 三菱マテリアル株式会社 絶縁回路基板

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