JP2022173930A5 - - Google Patents

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Publication number
JP2022173930A5
JP2022173930A5 JP2021079993A JP2021079993A JP2022173930A5 JP 2022173930 A5 JP2022173930 A5 JP 2022173930A5 JP 2021079993 A JP2021079993 A JP 2021079993A JP 2021079993 A JP2021079993 A JP 2021079993A JP 2022173930 A5 JP2022173930 A5 JP 2022173930A5
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JP
Japan
Prior art keywords
sealing resin
resin layer
thin film
electrode
film capacitor
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Application number
JP2021079993A
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English (en)
Japanese (ja)
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JP2022173930A (ja
JP7651797B2 (ja
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Priority to JP2021079993A priority Critical patent/JP7651797B2/ja
Priority claimed from JP2021079993A external-priority patent/JP7651797B2/ja
Priority to US17/660,701 priority patent/US11729914B2/en
Publication of JP2022173930A publication Critical patent/JP2022173930A/ja
Publication of JP2022173930A5 publication Critical patent/JP2022173930A5/ja
Application granted granted Critical
Publication of JP7651797B2 publication Critical patent/JP7651797B2/ja
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JP2021079993A 2021-05-10 2021-05-10 配線基板及びその製造方法 Active JP7651797B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021079993A JP7651797B2 (ja) 2021-05-10 2021-05-10 配線基板及びその製造方法
US17/660,701 US11729914B2 (en) 2021-05-10 2022-04-26 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021079993A JP7651797B2 (ja) 2021-05-10 2021-05-10 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2022173930A JP2022173930A (ja) 2022-11-22
JP2022173930A5 true JP2022173930A5 (https=) 2023-11-30
JP7651797B2 JP7651797B2 (ja) 2025-03-27

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ID=83900904

Family Applications (1)

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JP2021079993A Active JP7651797B2 (ja) 2021-05-10 2021-05-10 配線基板及びその製造方法

Country Status (2)

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US (1) US11729914B2 (https=)
JP (1) JP7651797B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115799182A (zh) * 2022-12-02 2023-03-14 珠海越亚半导体股份有限公司 一种元器件封装基板结构及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6826947B2 (ja) * 2017-05-18 2021-02-10 新光電気工業株式会社 配線基板、配線基板の製造方法
JP2019179865A (ja) 2018-03-30 2019-10-17 富士通株式会社 回路基板及び回路基板の製造方法
WO2019216300A1 (ja) * 2018-05-08 2019-11-14 株式会社村田製作所 高周波モジュール
JP2020077857A (ja) * 2018-09-28 2020-05-21 太陽誘電株式会社 モジュールおよびその製造方法
JP7482602B2 (ja) * 2019-02-20 2024-05-14 Tdk株式会社 薄膜キャパシタ内蔵基板及びその製造方法
JP7318428B2 (ja) * 2019-09-04 2023-08-01 Tdk株式会社 電子部品内蔵回路基板及びその製造方法

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