JPWO2023199808A5 - - Google Patents

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Publication number
JPWO2023199808A5
JPWO2023199808A5 JP2024514914A JP2024514914A JPWO2023199808A5 JP WO2023199808 A5 JPWO2023199808 A5 JP WO2023199808A5 JP 2024514914 A JP2024514914 A JP 2024514914A JP 2024514914 A JP2024514914 A JP 2024514914A JP WO2023199808 A5 JPWO2023199808 A5 JP WO2023199808A5
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor element
signal terminal
support member
power terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024514914A
Other languages
English (en)
Japanese (ja)
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JPWO2023199808A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/014042 external-priority patent/WO2023199808A1/ja
Publication of JPWO2023199808A1 publication Critical patent/JPWO2023199808A1/ja
Publication of JPWO2023199808A5 publication Critical patent/JPWO2023199808A5/ja
Pending legal-status Critical Current

Links

JP2024514914A 2022-04-12 2023-04-05 Pending JPWO2023199808A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022065748 2022-04-12
PCT/JP2023/014042 WO2023199808A1 (ja) 2022-04-12 2023-04-05 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023199808A1 JPWO2023199808A1 (https=) 2023-10-19
JPWO2023199808A5 true JPWO2023199808A5 (https=) 2024-12-26

Family

ID=88329693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024514914A Pending JPWO2023199808A1 (https=) 2022-04-12 2023-04-05

Country Status (2)

Country Link
JP (1) JPWO2023199808A1 (https=)
WO (1) WO2023199808A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3194906B2 (ja) * 1998-04-28 2001-08-06 アルス精密株式会社 半導体パッケージの製造方法、及びこれにより製造される半導体パッケージ
JP2000091493A (ja) * 1998-09-16 2000-03-31 Mitsui High Tec Inc 表面実装型半導体装置
US7285849B2 (en) * 2005-11-18 2007-10-23 Fairchild Semiconductor Corporation Semiconductor die package using leadframe and clip and method of manufacturing
JP7090494B2 (ja) * 2018-07-12 2022-06-24 株式会社 日立パワーデバイス 半導体装置および半導体装置の製造方法
JP7459465B2 (ja) * 2019-08-28 2024-04-02 富士電機株式会社 半導体装置及び半導体装置の製造方法

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