JPWO2023032667A5 - - Google Patents

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Publication number
JPWO2023032667A5
JPWO2023032667A5 JP2023545425A JP2023545425A JPWO2023032667A5 JP WO2023032667 A5 JPWO2023032667 A5 JP WO2023032667A5 JP 2023545425 A JP2023545425 A JP 2023545425A JP 2023545425 A JP2023545425 A JP 2023545425A JP WO2023032667 A5 JPWO2023032667 A5 JP WO2023032667A5
Authority
JP
Japan
Prior art keywords
semiconductor device
conductive layer
signal terminal
thickness direction
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545425A
Other languages
English (en)
Japanese (ja)
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JPWO2023032667A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/031038 external-priority patent/WO2023032667A1/ja
Publication of JPWO2023032667A1 publication Critical patent/JPWO2023032667A1/ja
Publication of JPWO2023032667A5 publication Critical patent/JPWO2023032667A5/ja
Pending legal-status Critical Current

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JP2023545425A 2021-09-06 2022-08-17 Pending JPWO2023032667A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021144534 2021-09-06
PCT/JP2022/031038 WO2023032667A1 (ja) 2021-09-06 2022-08-17 半導体装置、および半導体装置の取付け構造

Publications (2)

Publication Number Publication Date
JPWO2023032667A1 JPWO2023032667A1 (https=) 2023-03-09
JPWO2023032667A5 true JPWO2023032667A5 (https=) 2024-05-28

Family

ID=85411115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545425A Pending JPWO2023032667A1 (https=) 2021-09-06 2022-08-17

Country Status (5)

Country Link
US (1) US20240203849A1 (https=)
JP (1) JPWO2023032667A1 (https=)
CN (1) CN117897808A (https=)
DE (1) DE112022003874T5 (https=)
WO (1) WO2023032667A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039700A (ja) * 2002-06-28 2004-02-05 Fuji Electric Holdings Co Ltd 半導体パワーモジュール
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP5126278B2 (ja) * 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法
JP6594000B2 (ja) 2015-02-26 2019-10-23 ローム株式会社 半導体装置
US10957630B2 (en) * 2018-12-19 2021-03-23 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device and semiconductor device manufacturing method

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