JPWO2023032667A1 - - Google Patents
Info
- Publication number
- JPWO2023032667A1 JPWO2023032667A1 JP2023545425A JP2023545425A JPWO2023032667A1 JP WO2023032667 A1 JPWO2023032667 A1 JP WO2023032667A1 JP 2023545425 A JP2023545425 A JP 2023545425A JP 2023545425 A JP2023545425 A JP 2023545425A JP WO2023032667 A1 JPWO2023032667 A1 JP WO2023032667A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021144534 | 2021-09-06 | ||
| PCT/JP2022/031038 WO2023032667A1 (ja) | 2021-09-06 | 2022-08-17 | 半導体装置、および半導体装置の取付け構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032667A1 true JPWO2023032667A1 (https=) | 2023-03-09 |
| JPWO2023032667A5 JPWO2023032667A5 (https=) | 2024-05-28 |
Family
ID=85411115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545425A Pending JPWO2023032667A1 (https=) | 2021-09-06 | 2022-08-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240203849A1 (https=) |
| JP (1) | JPWO2023032667A1 (https=) |
| CN (1) | CN117897808A (https=) |
| DE (1) | DE112022003874T5 (https=) |
| WO (1) | WO2023032667A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039700A (ja) * | 2002-06-28 | 2004-02-05 | Fuji Electric Holdings Co Ltd | 半導体パワーモジュール |
| JP2007073743A (ja) * | 2005-09-07 | 2007-03-22 | Denso Corp | 半導体装置 |
| JP5126278B2 (ja) * | 2010-02-04 | 2013-01-23 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP6594000B2 (ja) | 2015-02-26 | 2019-10-23 | ローム株式会社 | 半導体装置 |
| US10957630B2 (en) * | 2018-12-19 | 2021-03-23 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device and semiconductor device manufacturing method |
-
2022
- 2022-08-17 JP JP2023545425A patent/JPWO2023032667A1/ja active Pending
- 2022-08-17 WO PCT/JP2022/031038 patent/WO2023032667A1/ja not_active Ceased
- 2022-08-17 DE DE112022003874.8T patent/DE112022003874T5/de active Pending
- 2022-08-17 CN CN202280059479.9A patent/CN117897808A/zh active Pending
-
2024
- 2024-01-23 US US18/420,305 patent/US20240203849A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023032667A1 (ja) | 2023-03-09 |
| US20240203849A1 (en) | 2024-06-20 |
| CN117897808A (zh) | 2024-04-16 |
| DE112022003874T5 (de) | 2024-05-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231225 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250807 |