DE112022003874T5 - Halbleiterbauteil und montagestruktur für das halbleiterbauteil - Google Patents

Halbleiterbauteil und montagestruktur für das halbleiterbauteil Download PDF

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Publication number
DE112022003874T5
DE112022003874T5 DE112022003874.8T DE112022003874T DE112022003874T5 DE 112022003874 T5 DE112022003874 T5 DE 112022003874T5 DE 112022003874 T DE112022003874 T DE 112022003874T DE 112022003874 T5 DE112022003874 T5 DE 112022003874T5
Authority
DE
Germany
Prior art keywords
signal terminal
conductive layer
thickness direction
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022003874.8T
Other languages
German (de)
English (en)
Inventor
Ryosuke Fukuda
Kohei Tanikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022003874T5 publication Critical patent/DE112022003874T5/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
DE112022003874.8T 2021-09-06 2022-08-17 Halbleiterbauteil und montagestruktur für das halbleiterbauteil Pending DE112022003874T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021144534 2021-09-06
JP2021-144534 2021-09-06
PCT/JP2022/031038 WO2023032667A1 (ja) 2021-09-06 2022-08-17 半導体装置、および半導体装置の取付け構造

Publications (1)

Publication Number Publication Date
DE112022003874T5 true DE112022003874T5 (de) 2024-05-29

Family

ID=85411115

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022003874.8T Pending DE112022003874T5 (de) 2021-09-06 2022-08-17 Halbleiterbauteil und montagestruktur für das halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240203849A1 (https=)
JP (1) JPWO2023032667A1 (https=)
CN (1) CN117897808A (https=)
DE (1) DE112022003874T5 (https=)
WO (1) WO2023032667A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162773A (ja) 2015-02-26 2016-09-05 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039700A (ja) * 2002-06-28 2004-02-05 Fuji Electric Holdings Co Ltd 半導体パワーモジュール
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP5126278B2 (ja) * 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法
US10957630B2 (en) * 2018-12-19 2021-03-23 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device and semiconductor device manufacturing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162773A (ja) 2015-02-26 2016-09-05 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2023032667A1 (ja) 2023-03-09
JPWO2023032667A1 (https=) 2023-03-09
US20240203849A1 (en) 2024-06-20
CN117897808A (zh) 2024-04-16

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Legal Events

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R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023310000

Ipc: H10W0074100000