CN117897808A - 半导体装置以及半导体装置的安装结构 - Google Patents

半导体装置以及半导体装置的安装结构 Download PDF

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Publication number
CN117897808A
CN117897808A CN202280059479.9A CN202280059479A CN117897808A CN 117897808 A CN117897808 A CN 117897808A CN 202280059479 A CN202280059479 A CN 202280059479A CN 117897808 A CN117897808 A CN 117897808A
Authority
CN
China
Prior art keywords
semiconductor device
signal terminal
face
conductive layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280059479.9A
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English (en)
Chinese (zh)
Inventor
福田谅介
谷川昂平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN117897808A publication Critical patent/CN117897808A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202280059479.9A 2021-09-06 2022-08-17 半导体装置以及半导体装置的安装结构 Pending CN117897808A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021144534 2021-09-06
JP2021-144534 2021-09-06
PCT/JP2022/031038 WO2023032667A1 (ja) 2021-09-06 2022-08-17 半導体装置、および半導体装置の取付け構造

Publications (1)

Publication Number Publication Date
CN117897808A true CN117897808A (zh) 2024-04-16

Family

ID=85411115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280059479.9A Pending CN117897808A (zh) 2021-09-06 2022-08-17 半导体装置以及半导体装置的安装结构

Country Status (5)

Country Link
US (1) US20240203849A1 (https=)
JP (1) JPWO2023032667A1 (https=)
CN (1) CN117897808A (https=)
DE (1) DE112022003874T5 (https=)
WO (1) WO2023032667A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039700A (ja) * 2002-06-28 2004-02-05 Fuji Electric Holdings Co Ltd 半導体パワーモジュール
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP5126278B2 (ja) * 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法
JP6594000B2 (ja) 2015-02-26 2019-10-23 ローム株式会社 半導体装置
US10957630B2 (en) * 2018-12-19 2021-03-23 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device and semiconductor device manufacturing method

Also Published As

Publication number Publication date
WO2023032667A1 (ja) 2023-03-09
JPWO2023032667A1 (https=) 2023-03-09
US20240203849A1 (en) 2024-06-20
DE112022003874T5 (de) 2024-05-29

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