JPWO2023199808A1 - - Google Patents
Info
- Publication number
- JPWO2023199808A1 JPWO2023199808A1 JP2024514914A JP2024514914A JPWO2023199808A1 JP WO2023199808 A1 JPWO2023199808 A1 JP WO2023199808A1 JP 2024514914 A JP2024514914 A JP 2024514914A JP 2024514914 A JP2024514914 A JP 2024514914A JP WO2023199808 A1 JPWO2023199808 A1 JP WO2023199808A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022065748 | 2022-04-12 | ||
| PCT/JP2023/014042 WO2023199808A1 (ja) | 2022-04-12 | 2023-04-05 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023199808A1 true JPWO2023199808A1 (https=) | 2023-10-19 |
| JPWO2023199808A5 JPWO2023199808A5 (https=) | 2024-12-26 |
Family
ID=88329693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024514914A Pending JPWO2023199808A1 (https=) | 2022-04-12 | 2023-04-05 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023199808A1 (https=) |
| WO (1) | WO2023199808A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3194906B2 (ja) * | 1998-04-28 | 2001-08-06 | アルス精密株式会社 | 半導体パッケージの製造方法、及びこれにより製造される半導体パッケージ |
| JP2000091493A (ja) * | 1998-09-16 | 2000-03-31 | Mitsui High Tec Inc | 表面実装型半導体装置 |
| US7285849B2 (en) * | 2005-11-18 | 2007-10-23 | Fairchild Semiconductor Corporation | Semiconductor die package using leadframe and clip and method of manufacturing |
| JP7090494B2 (ja) * | 2018-07-12 | 2022-06-24 | 株式会社 日立パワーデバイス | 半導体装置および半導体装置の製造方法 |
| JP7459465B2 (ja) * | 2019-08-28 | 2024-04-02 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2023
- 2023-04-05 JP JP2024514914A patent/JPWO2023199808A1/ja active Pending
- 2023-04-05 WO PCT/JP2023/014042 patent/WO2023199808A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023199808A1 (ja) | 2023-10-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240918 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260327 |