JPWO2023095659A5 - - Google Patents

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Publication number
JPWO2023095659A5
JPWO2023095659A5 JP2023563624A JP2023563624A JPWO2023095659A5 JP WO2023095659 A5 JPWO2023095659 A5 JP WO2023095659A5 JP 2023563624 A JP2023563624 A JP 2023563624A JP 2023563624 A JP2023563624 A JP 2023563624A JP WO2023095659 A5 JPWO2023095659 A5 JP WO2023095659A5
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JP
Japan
Prior art keywords
semiconductor
semiconductor device
bonding layer
layer
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023563624A
Other languages
English (en)
Japanese (ja)
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JPWO2023095659A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/042243 external-priority patent/WO2023095659A1/ja
Publication of JPWO2023095659A1 publication Critical patent/JPWO2023095659A1/ja
Publication of JPWO2023095659A5 publication Critical patent/JPWO2023095659A5/ja
Pending legal-status Critical Current

Links

JP2023563624A 2021-11-29 2022-11-14 Pending JPWO2023095659A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021192779 2021-11-29
PCT/JP2022/042243 WO2023095659A1 (ja) 2021-11-29 2022-11-14 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023095659A1 JPWO2023095659A1 (https=) 2023-06-01
JPWO2023095659A5 true JPWO2023095659A5 (https=) 2024-08-09

Family

ID=86539584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023563624A Pending JPWO2023095659A1 (https=) 2021-11-29 2022-11-14

Country Status (5)

Country Link
US (1) US20240312877A1 (https=)
JP (1) JPWO2023095659A1 (https=)
CN (1) CN118339651A (https=)
DE (1) DE112022005155T5 (https=)
WO (1) WO2023095659A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7582156B2 (ja) * 2021-10-27 2024-11-13 三菱電機株式会社 半導体装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5303167B2 (ja) * 2008-03-25 2013-10-02 ローム株式会社 スイッチ制御装置及びこれを用いたモータ駆動装置
JP6104512B2 (ja) * 2011-04-01 2017-03-29 ローム株式会社 温度検出装置
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6522402B2 (ja) * 2015-04-16 2019-05-29 ローム株式会社 半導体装置

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