JPWO2023095659A1 - - Google Patents
Info
- Publication number
- JPWO2023095659A1 JPWO2023095659A1 JP2023563624A JP2023563624A JPWO2023095659A1 JP WO2023095659 A1 JPWO2023095659 A1 JP WO2023095659A1 JP 2023563624 A JP2023563624 A JP 2023563624A JP 2023563624 A JP2023563624 A JP 2023563624A JP WO2023095659 A1 JPWO2023095659 A1 JP WO2023095659A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/413—Insulating or insulated substrates serving as die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192779 | 2021-11-29 | ||
| PCT/JP2022/042243 WO2023095659A1 (ja) | 2021-11-29 | 2022-11-14 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023095659A1 true JPWO2023095659A1 (https=) | 2023-06-01 |
| JPWO2023095659A5 JPWO2023095659A5 (https=) | 2024-08-09 |
Family
ID=86539584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023563624A Pending JPWO2023095659A1 (https=) | 2021-11-29 | 2022-11-14 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240312877A1 (https=) |
| JP (1) | JPWO2023095659A1 (https=) |
| CN (1) | CN118339651A (https=) |
| DE (1) | DE112022005155T5 (https=) |
| WO (1) | WO2023095659A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7582156B2 (ja) * | 2021-10-27 | 2024-11-13 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5303167B2 (ja) * | 2008-03-25 | 2013-10-02 | ローム株式会社 | スイッチ制御装置及びこれを用いたモータ駆動装置 |
| JP6104512B2 (ja) * | 2011-04-01 | 2017-03-29 | ローム株式会社 | 温度検出装置 |
| JP6591637B2 (ja) * | 2013-11-13 | 2019-10-16 | ローム株式会社 | 半導体装置および半導体モジュール |
| JP6522402B2 (ja) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-11-14 CN CN202280078821.XA patent/CN118339651A/zh active Pending
- 2022-11-14 DE DE112022005155.8T patent/DE112022005155T5/de active Pending
- 2022-11-14 WO PCT/JP2022/042243 patent/WO2023095659A1/ja not_active Ceased
- 2022-11-14 JP JP2023563624A patent/JPWO2023095659A1/ja active Pending
-
2024
- 2024-05-21 US US18/670,165 patent/US20240312877A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023095659A1 (ja) | 2023-06-01 |
| DE112022005155T5 (de) | 2024-08-29 |
| US20240312877A1 (en) | 2024-09-19 |
| CN118339651A (zh) | 2024-07-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240322 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251107 |