JPWO2022168606A1 - - Google Patents
Info
- Publication number
- JPWO2022168606A1 JPWO2022168606A1 JP2022579428A JP2022579428A JPWO2022168606A1 JP WO2022168606 A1 JPWO2022168606 A1 JP WO2022168606A1 JP 2022579428 A JP2022579428 A JP 2022579428A JP 2022579428 A JP2022579428 A JP 2022579428A JP WO2022168606 A1 JPWO2022168606 A1 JP WO2022168606A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
- H10W70/457—Materials of metallic layers on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021014914 | 2021-02-02 | ||
| PCT/JP2022/001749 WO2022168606A1 (ja) | 2021-02-02 | 2022-01-19 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022168606A1 true JPWO2022168606A1 (https=) | 2022-08-11 |
Family
ID=82740701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579428A Pending JPWO2022168606A1 (https=) | 2021-02-02 | 2022-01-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230378035A1 (https=) |
| JP (1) | JPWO2022168606A1 (https=) |
| CN (1) | CN116964735A (https=) |
| DE (1) | DE112022000491T5 (https=) |
| WO (1) | WO2022168606A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63223141A (ja) * | 1987-03-11 | 1988-09-16 | Toshiba Corp | リ−ドフレ−ム材 |
| JP2006032709A (ja) * | 2004-07-16 | 2006-02-02 | Matsushita Electric Ind Co Ltd | リードフレームおよびこれを用いた半導体装置の製造方法 |
| JP2009232637A (ja) * | 2008-03-25 | 2009-10-08 | Rohm Co Ltd | スイッチ制御装置及びこれを用いたモータ駆動装置 |
| JP2014163702A (ja) * | 2013-02-21 | 2014-09-08 | Asahi Kasei Electronics Co Ltd | 磁気センサ装置 |
| JP2016207714A (ja) * | 2015-04-16 | 2016-12-08 | ローム株式会社 | 半導体装置 |
| JP2019012755A (ja) * | 2017-06-29 | 2019-01-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2019203139A1 (ja) * | 2018-04-19 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105790744B (zh) | 2009-11-05 | 2019-09-03 | 罗姆股份有限公司 | 半导体器件、检查半导体器件的方法和装置 |
| JP2019012087A (ja) * | 2018-10-29 | 2019-01-24 | 株式会社東芝 | センサ |
-
2022
- 2022-01-19 DE DE112022000491.6T patent/DE112022000491T5/de active Granted
- 2022-01-19 WO PCT/JP2022/001749 patent/WO2022168606A1/ja not_active Ceased
- 2022-01-19 CN CN202280012623.3A patent/CN116964735A/zh active Pending
- 2022-01-19 JP JP2022579428A patent/JPWO2022168606A1/ja active Pending
-
2023
- 2023-08-01 US US18/363,418 patent/US20230378035A1/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63223141A (ja) * | 1987-03-11 | 1988-09-16 | Toshiba Corp | リ−ドフレ−ム材 |
| JP2006032709A (ja) * | 2004-07-16 | 2006-02-02 | Matsushita Electric Ind Co Ltd | リードフレームおよびこれを用いた半導体装置の製造方法 |
| JP2009232637A (ja) * | 2008-03-25 | 2009-10-08 | Rohm Co Ltd | スイッチ制御装置及びこれを用いたモータ駆動装置 |
| JP2014163702A (ja) * | 2013-02-21 | 2014-09-08 | Asahi Kasei Electronics Co Ltd | 磁気センサ装置 |
| JP2016207714A (ja) * | 2015-04-16 | 2016-12-08 | ローム株式会社 | 半導体装置 |
| JP2019012755A (ja) * | 2017-06-29 | 2019-01-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2019203139A1 (ja) * | 2018-04-19 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022168606A1 (ja) | 2022-08-11 |
| US20230378035A1 (en) | 2023-11-23 |
| DE112022000491T5 (de) | 2023-11-23 |
| CN116964735A (zh) | 2023-10-27 |
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