JPWO2023120353A5 - - Google Patents
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- Publication number
- JPWO2023120353A5 JPWO2023120353A5 JP2023569362A JP2023569362A JPWO2023120353A5 JP WO2023120353 A5 JPWO2023120353 A5 JP WO2023120353A5 JP 2023569362 A JP2023569362 A JP 2023569362A JP 2023569362 A JP2023569362 A JP 2023569362A JP WO2023120353 A5 JPWO2023120353 A5 JP WO2023120353A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor device
- electrode
- conductive
- vickers hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 24
- 238000009792 diffusion process Methods 0.000 claims 4
- 239000007790 solid phase Substances 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021207018 | 2021-12-21 | ||
| PCT/JP2022/046162 WO2023120353A1 (ja) | 2021-12-21 | 2022-12-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120353A1 JPWO2023120353A1 (https=) | 2023-06-29 |
| JPWO2023120353A5 true JPWO2023120353A5 (https=) | 2024-09-03 |
Family
ID=86902511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569362A Pending JPWO2023120353A1 (https=) | 2021-12-21 | 2022-12-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240304589A1 (https=) |
| JP (1) | JPWO2023120353A1 (https=) |
| CN (1) | CN118414711A (https=) |
| DE (1) | DE112022005481T5 (https=) |
| WO (1) | WO2023120353A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7306248B2 (ja) * | 2019-12-09 | 2023-07-11 | 株式会社デンソー | 半導体モジュール |
| JP2021128962A (ja) * | 2020-02-10 | 2021-09-02 | トヨタ自動車株式会社 | 半導体モジュール |
| JP2023101032A (ja) * | 2020-05-20 | 2023-07-20 | 日立Astemo株式会社 | パワー半導体素子 |
| JP2021007182A (ja) * | 2020-10-19 | 2021-01-21 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
-
2022
- 2022-12-15 DE DE112022005481.6T patent/DE112022005481T5/de active Pending
- 2022-12-15 WO PCT/JP2022/046162 patent/WO2023120353A1/ja not_active Ceased
- 2022-12-15 JP JP2023569362A patent/JPWO2023120353A1/ja active Pending
- 2022-12-15 CN CN202280084122.6A patent/CN118414711A/zh active Pending
-
2024
- 2024-05-17 US US18/667,009 patent/US20240304589A1/en active Pending
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