JPWO2023112723A5 - - Google Patents

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Publication number
JPWO2023112723A5
JPWO2023112723A5 JP2023567693A JP2023567693A JPWO2023112723A5 JP WO2023112723 A5 JPWO2023112723 A5 JP WO2023112723A5 JP 2023567693 A JP2023567693 A JP 2023567693A JP 2023567693 A JP2023567693 A JP 2023567693A JP WO2023112723 A5 JPWO2023112723 A5 JP WO2023112723A5
Authority
JP
Japan
Prior art keywords
semiconductor device
terminal
sealing resin
mounting portion
extends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023567693A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023112723A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/044545 external-priority patent/WO2023112723A1/ja
Publication of JPWO2023112723A1 publication Critical patent/JPWO2023112723A1/ja
Publication of JPWO2023112723A5 publication Critical patent/JPWO2023112723A5/ja
Pending legal-status Critical Current

Links

JP2023567693A 2021-12-14 2022-12-02 Pending JPWO2023112723A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021202614 2021-12-14
PCT/JP2022/044545 WO2023112723A1 (ja) 2021-12-14 2022-12-02 半導体装置、および半導体装置の実装体

Publications (2)

Publication Number Publication Date
JPWO2023112723A1 JPWO2023112723A1 (https=) 2023-06-22
JPWO2023112723A5 true JPWO2023112723A5 (https=) 2024-08-26

Family

ID=86774296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023567693A Pending JPWO2023112723A1 (https=) 2021-12-14 2022-12-02

Country Status (5)

Country Link
US (1) US20240282681A1 (https=)
JP (1) JPWO2023112723A1 (https=)
CN (1) CN118435348A (https=)
DE (1) DE112022004162T5 (https=)
WO (1) WO2023112723A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS327516Y1 (https=) * 1955-05-23 1957-07-19
JPS58116221U (ja) * 1982-01-30 1983-08-08 ニチコン株式会社 有極性電子部品
JP2000208896A (ja) * 1999-01-13 2000-07-28 Fuji Electric Co Ltd 電子部品搭載モジュ―ル及び電子部品搭載方法
DE102015109073B4 (de) * 2015-06-09 2023-08-10 Infineon Technologies Ag Elektronische Vorrichtungen mit erhöhten Kriechstrecken
CN114868246A (zh) * 2019-12-25 2022-08-05 罗姆股份有限公司 半导体模块

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