JPWO2023053874A5 - - Google Patents
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- Publication number
- JPWO2023053874A5 JPWO2023053874A5 JP2023550503A JP2023550503A JPWO2023053874A5 JP WO2023053874 A5 JPWO2023053874 A5 JP WO2023053874A5 JP 2023550503 A JP2023550503 A JP 2023550503A JP 2023550503 A JP2023550503 A JP 2023550503A JP WO2023053874 A5 JPWO2023053874 A5 JP WO2023053874A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pad portion
- elements
- thickness direction
- bonding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021160665 | 2021-09-30 | ||
| PCT/JP2022/033566 WO2023053874A1 (ja) | 2021-09-30 | 2022-09-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023053874A1 JPWO2023053874A1 (https=) | 2023-04-06 |
| JPWO2023053874A5 true JPWO2023053874A5 (https=) | 2024-06-20 |
Family
ID=85782389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023550503A Pending JPWO2023053874A1 (https=) | 2021-09-30 | 2022-09-07 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240222232A1 (https=) |
| JP (1) | JPWO2023053874A1 (https=) |
| CN (1) | CN117999650A (https=) |
| DE (1) | DE112022004698T5 (https=) |
| WO (1) | WO2023053874A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10116934A (ja) * | 1996-10-09 | 1998-05-06 | Fuji Electric Co Ltd | 樹脂封止半導体装置およびその製造方法 |
| JP5119981B2 (ja) * | 2008-03-04 | 2013-01-16 | 株式会社デンソー | モールドパッケージ |
| JP2014207430A (ja) * | 2013-03-21 | 2014-10-30 | ローム株式会社 | 半導体装置 |
| JP7088224B2 (ja) * | 2019-03-19 | 2022-06-21 | 株式会社デンソー | 半導体モジュールおよびこれに用いられる半導体装置 |
-
2022
- 2022-09-07 CN CN202280064916.6A patent/CN117999650A/zh active Pending
- 2022-09-07 WO PCT/JP2022/033566 patent/WO2023053874A1/ja not_active Ceased
- 2022-09-07 DE DE112022004698.8T patent/DE112022004698T5/de active Pending
- 2022-09-07 JP JP2023550503A patent/JPWO2023053874A1/ja active Pending
-
2024
- 2024-03-14 US US18/604,939 patent/US20240222232A1/en active Pending
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