JPWO2024161996A5 - - Google Patents

Info

Publication number
JPWO2024161996A5
JPWO2024161996A5 JP2024574409A JP2024574409A JPWO2024161996A5 JP WO2024161996 A5 JPWO2024161996 A5 JP WO2024161996A5 JP 2024574409 A JP2024574409 A JP 2024574409A JP 2024574409 A JP2024574409 A JP 2024574409A JP WO2024161996 A5 JPWO2024161996 A5 JP WO2024161996A5
Authority
JP
Japan
Prior art keywords
thickness direction
support member
conductive support
semiconductor device
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024574409A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024161996A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/001083 external-priority patent/WO2024161996A1/ja
Publication of JPWO2024161996A1 publication Critical patent/JPWO2024161996A1/ja
Publication of JPWO2024161996A5 publication Critical patent/JPWO2024161996A5/ja
Pending legal-status Critical Current

Links

JP2024574409A 2023-02-01 2024-01-17 Pending JPWO2024161996A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023013713 2023-02-01
PCT/JP2024/001083 WO2024161996A1 (ja) 2023-02-01 2024-01-17 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024161996A1 JPWO2024161996A1 (https=) 2024-08-08
JPWO2024161996A5 true JPWO2024161996A5 (https=) 2025-10-09

Family

ID=92146571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574409A Pending JPWO2024161996A1 (https=) 2023-02-01 2024-01-17

Country Status (2)

Country Link
JP (1) JPWO2024161996A1 (https=)
WO (1) WO2024161996A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011204862A (ja) * 2010-03-25 2011-10-13 Sanyo Electric Co Ltd 半導体装置およびその製造方法
WO2016203764A1 (ja) * 2015-06-17 2016-12-22 パナソニックＩｐマネジメント株式会社 半導体装置及びモジュール部品
CN113748509B (zh) * 2019-04-24 2024-04-30 罗姆股份有限公司 半导体装置

Similar Documents

Publication Publication Date Title
JP2024128127A5 (https=)
JP2021002644A5 (https=)
JPWO2024161996A5 (https=)
JP4582491B2 (ja) 金属基板
JPH08138773A (ja) 印刷配線板の電極部構造
JPH0420279B2 (https=)
JPWO2023140001A5 (https=)
JPWO2021161526A5 (https=)
JP2757570B2 (ja) 金属基板の実装構造
JPWO2024157863A5 (https=)
JP7264630B2 (ja) 電子モジュール
WO2024161996A1 (ja) 半導体装置
JPH04162454A (ja) 混成集積回路装置
JPH0636592Y2 (ja) 混成集積回路装置
JP2771567B2 (ja) 混成集積回路
JPH04171848A (ja) 半導体装置
JPWO2024154790A5 (https=)
JPS61166148A (ja) 多層混成集積回路装置
JPWO2023176351A5 (https=)
JPWO2023248729A5 (https=)
JPWO2024181322A5 (https=)
JPWO2022259825A5 (https=)
JP2025084818A5 (https=)
JP2023060634A (ja) 放熱基板およびその製造方法
JPWO2024247739A5 (https=)