JPWO2024181322A5 - - Google Patents

Info

Publication number
JPWO2024181322A5
JPWO2024181322A5 JP2025503850A JP2025503850A JPWO2024181322A5 JP WO2024181322 A5 JPWO2024181322 A5 JP WO2024181322A5 JP 2025503850 A JP2025503850 A JP 2025503850A JP 2025503850 A JP2025503850 A JP 2025503850A JP WO2024181322 A5 JPWO2024181322 A5 JP WO2024181322A5
Authority
JP
Japan
Prior art keywords
layer
wiring board
substrate layer
board according
organic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025503850A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024181322A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/006627 external-priority patent/WO2024181322A1/ja
Publication of JPWO2024181322A1 publication Critical patent/JPWO2024181322A1/ja
Publication of JPWO2024181322A5 publication Critical patent/JPWO2024181322A5/ja
Pending legal-status Critical Current

Links

JP2025503850A 2023-02-27 2024-02-22 Pending JPWO2024181322A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023028599 2023-02-27
PCT/JP2024/006627 WO2024181322A1 (ja) 2023-02-27 2024-02-22 配線基板および配線基板を用いた光モジュール

Publications (2)

Publication Number Publication Date
JPWO2024181322A1 JPWO2024181322A1 (https=) 2024-09-06
JPWO2024181322A5 true JPWO2024181322A5 (https=) 2025-10-21

Family

ID=92590538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025503850A Pending JPWO2024181322A1 (https=) 2023-02-27 2024-02-22

Country Status (2)

Country Link
JP (1) JPWO2024181322A1 (https=)
WO (1) WO2024181322A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3767246B2 (ja) * 1999-05-26 2006-04-19 富士通株式会社 複合モジュール及びプリント回路基板ユニット
JP4966156B2 (ja) * 2007-10-23 2012-07-04 ソニーケミカル＆インフォメーションデバイス株式会社 配線基板の受台及びこれを用いた配線基板の接続装置、接続方法
JP5462010B2 (ja) * 2010-01-27 2014-04-02 日本オクラロ株式会社 光モジュール
JP5825111B2 (ja) * 2012-01-18 2015-12-02 日本電気株式会社 シリコンインターポーザ及びそれを用いる半導体装置
WO2019050046A1 (ja) * 2017-09-11 2019-03-14 Ｎｇｋエレクトロデバイス株式会社 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ
JP7709298B2 (ja) * 2021-04-26 2025-07-16 キヤノン株式会社 フレキシブル配線板、モジュール、及び電子機器

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