JPWO2024181322A1 - - Google Patents
Info
- Publication number
- JPWO2024181322A1 JPWO2024181322A1 JP2025503850A JP2025503850A JPWO2024181322A1 JP WO2024181322 A1 JPWO2024181322 A1 JP WO2024181322A1 JP 2025503850 A JP2025503850 A JP 2025503850A JP 2025503850 A JP2025503850 A JP 2025503850A JP WO2024181322 A1 JPWO2024181322 A1 JP WO2024181322A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023028599 | 2023-02-27 | ||
| PCT/JP2024/006627 WO2024181322A1 (ja) | 2023-02-27 | 2024-02-22 | 配線基板および配線基板を用いた光モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024181322A1 true JPWO2024181322A1 (https=) | 2024-09-06 |
| JPWO2024181322A5 JPWO2024181322A5 (https=) | 2025-10-21 |
Family
ID=92590538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025503850A Pending JPWO2024181322A1 (https=) | 2023-02-27 | 2024-02-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024181322A1 (https=) |
| WO (1) | WO2024181322A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3767246B2 (ja) * | 1999-05-26 | 2006-04-19 | 富士通株式会社 | 複合モジュール及びプリント回路基板ユニット |
| JP4966156B2 (ja) * | 2007-10-23 | 2012-07-04 | ソニーケミカル＆インフォメーションデバイス株式会社 | 配線基板の受台及びこれを用いた配線基板の接続装置、接続方法 |
| JP5462010B2 (ja) * | 2010-01-27 | 2014-04-02 | 日本オクラロ株式会社 | 光モジュール |
| JP5825111B2 (ja) * | 2012-01-18 | 2015-12-02 | 日本電気株式会社 | シリコンインターポーザ及びそれを用いる半導体装置 |
| WO2019050046A1 (ja) * | 2017-09-11 | 2019-03-14 | Ｎｇｋエレクトロデバイス株式会社 | 配線基板とフレキシブル基板の接続構造および電子部品収納用パッケージ |
| JP7709298B2 (ja) * | 2021-04-26 | 2025-07-16 | キヤノン株式会社 | フレキシブル配線板、モジュール、及び電子機器 |
-
2024
- 2024-02-22 WO PCT/JP2024/006627 patent/WO2024181322A1/ja not_active Ceased
- 2024-02-22 JP JP2025503850A patent/JPWO2024181322A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024181322A1 (ja) | 2024-09-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250806 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250806 |