JPWO2024135226A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024135226A5 JPWO2024135226A5 JP2024565705A JP2024565705A JPWO2024135226A5 JP WO2024135226 A5 JPWO2024135226 A5 JP WO2024135226A5 JP 2024565705 A JP2024565705 A JP 2024565705A JP 2024565705 A JP2024565705 A JP 2024565705A JP WO2024135226 A5 JPWO2024135226 A5 JP WO2024135226A5
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- contact
- electronic component
- ceramic electronic
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022202663 | 2022-12-19 | ||
| PCT/JP2023/042187 WO2024135226A1 (ja) | 2022-12-19 | 2023-11-24 | 積層セラミック電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024135226A1 JPWO2024135226A1 (https=) | 2024-06-27 |
| JPWO2024135226A5 true JPWO2024135226A5 (https=) | 2025-06-30 |
Family
ID=91588568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024565705A Pending JPWO2024135226A1 (https=) | 2022-12-19 | 2023-11-24 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250259793A1 (https=) |
| EP (1) | EP4600985A1 (https=) |
| JP (1) | JPWO2024135226A1 (https=) |
| KR (1) | KR20250073405A (https=) |
| CN (1) | CN120153453A (https=) |
| WO (1) | WO2024135226A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5963425U (ja) * | 1982-10-19 | 1984-04-26 | 株式会社村田製作所 | 電子部品 |
| JP4736225B2 (ja) * | 2001-04-16 | 2011-07-27 | パナソニック株式会社 | コンデンサ |
| JP5353839B2 (ja) * | 2010-07-16 | 2013-11-27 | 株式会社村田製作所 | 電子部品 |
| JP2019009360A (ja) * | 2017-06-27 | 2019-01-17 | 株式会社村田製作所 | セラミック電子部品及びその実装構造 |
| KR20190099677A (ko) | 2018-02-19 | 2019-08-28 | 삼성전기주식회사 | 전자 부품 |
-
2023
- 2023-11-24 WO PCT/JP2023/042187 patent/WO2024135226A1/ja not_active Ceased
- 2023-11-24 JP JP2024565705A patent/JPWO2024135226A1/ja active Pending
- 2023-11-24 KR KR1020257013549A patent/KR20250073405A/ko active Pending
- 2023-11-24 CN CN202380076263.8A patent/CN120153453A/zh active Pending
- 2023-11-24 EP EP23906595.6A patent/EP4600985A1/en active Pending
-
2025
- 2025-04-30 US US19/194,398 patent/US20250259793A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5459444B2 (ja) | 電子部品 | |
| US10943740B2 (en) | Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement | |
| JP6372067B2 (ja) | セラミック電子部品 | |
| CN102956353B (zh) | 芯片部件结构体及其制造方法 | |
| JP2017022407A5 (https=) | ||
| JP2008300769A5 (https=) | ||
| JP2015065284A (ja) | 電子部品およびその製造方法 | |
| JP2015065283A (ja) | 電子部品およびその製造方法 | |
| JP2007013092A5 (https=) | ||
| JP2007536741A5 (https=) | ||
| CN112005326B (zh) | 具有外部接触的多层结构元件 | |
| JPWO2024135226A5 (https=) | ||
| JP2003124773A (ja) | チップ型圧電共振部品 | |
| JP2020115589A5 (https=) | ||
| JPWO2025013299A5 (https=) | ||
| JP6500713B2 (ja) | 加速度センサ | |
| JP2014045055A (ja) | 積層コンデンサ及び積層コンデンサ実装構造 | |
| JPWO2025004199A5 (https=) | ||
| JP2025084818A5 (https=) | ||
| JP3793565B2 (ja) | 配線基板 | |
| JP6810095B2 (ja) | チップ抵抗器、チップ抵抗器の実装構造 | |
| JP5906766B2 (ja) | リード線付き電子部品 | |
| JP3906086B2 (ja) | 配線基板 | |
| JP2018198249A (ja) | 配線基板 | |
| JPWO2025142038A5 (https=) |