JPWO2025004199A5 - - Google Patents

Info

Publication number
JPWO2025004199A5
JPWO2025004199A5 JP2025529062A JP2025529062A JPWO2025004199A5 JP WO2025004199 A5 JPWO2025004199 A5 JP WO2025004199A5 JP 2025529062 A JP2025529062 A JP 2025529062A JP 2025529062 A JP2025529062 A JP 2025529062A JP WO2025004199 A5 JPWO2025004199 A5 JP WO2025004199A5
Authority
JP
Japan
Prior art keywords
intermetallic compound
contact
electronic component
metal
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025529062A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025004199A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023868 external-priority patent/WO2025004199A1/ja
Publication of JPWO2025004199A1 publication Critical patent/JPWO2025004199A1/ja
Publication of JPWO2025004199A5 publication Critical patent/JPWO2025004199A5/ja
Pending legal-status Critical Current

Links

JP2025529062A 2023-06-27 2023-06-27 Pending JPWO2025004199A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/023868 WO2025004199A1 (ja) 2023-06-27 2023-06-27 積層セラミック電子部品

Publications (2)

Publication Number Publication Date
JPWO2025004199A1 JPWO2025004199A1 (https=) 2025-01-02
JPWO2025004199A5 true JPWO2025004199A5 (https=) 2026-02-25

Family

ID=93937834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025529062A Pending JPWO2025004199A1 (https=) 2023-06-27 2023-06-27

Country Status (5)

Country Link
US (1) US20250006429A1 (https=)
JP (1) JPWO2025004199A1 (https=)
KR (1) KR20260009885A (https=)
CN (1) CN121444190A (https=)
WO (1) WO2025004199A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12495495B2 (en) * 2023-07-05 2025-12-09 Olympus Medical Systems Corp. Wiring board, image pickup unit, endoscope, and method for manufacturing wiring board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6577012B1 (en) * 2001-08-13 2003-06-10 Amkor Technology, Inc. Laser defined pads for flip chip on leadframe package
JP6395322B2 (ja) * 2015-12-01 2018-09-26 太陽誘電株式会社 電子部品及びその製造方法、並びに回路基板
KR20190099677A (ko) 2018-02-19 2019-08-28 삼성전기주식회사 전자 부품
JP6966379B2 (ja) * 2018-04-23 2021-11-17 株式会社 日立パワーデバイス 半導体装置およびその製造方法
JP7494808B2 (ja) * 2021-06-25 2024-06-04 株式会社村田製作所 積層セラミック電子部品
JP7609028B2 (ja) * 2021-10-04 2025-01-07 株式会社村田製作所 積層セラミック電子部品

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